DSPIC30F6012A-20E/PF Microchip Technology, DSPIC30F6012A-20E/PF Datasheet - Page 137

IC DSPIC MCU/DSP 144K 64TQFP

DSPIC30F6012A-20E/PF

Manufacturer Part Number
DSPIC30F6012A-20E/PF
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6012A-20E/PF

Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TQFP, 64-VQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
68
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6012A-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
The following figure depicts the recommended circuit
for the conversion rates above 100 ksps. The
dsPIC30F6014A is shown as an example.
FIGURE 19-2:
The configuration procedures below give the required
setup values for the conversion speeds above 100
ksps.
19.7.1
The following configuration items are required to
achieve a 200 ksps conversion rate.
• Comply with conditions provided in
• Connect external V
• Set SSRC<2.0> = 111 in the ADCON1 register to
• Enable automatic sampling by setting the ASAM
• Write the SMPI<3.0> control bits in the ADCON2
© 2011 Microchip Technology Inc.
the recommended circuit as shown in
enable the auto convert option.
control bit in the ADCON1 register.
register for the desired number of conversions
between interrupts.
C2
0.1 μF
R2
10
V
DD
V
DD
200 KSPS CONFIGURATION
GUIDELINE
C1
0.01 μF
REF
dsPIC30F6011A/6012A/6013A/6014A
ADC VOLTAGE REFERENCE SCHEMATIC
1
2
3
4
5
6
7
8
9
10
V
V
13
14
15
16
17
18
19
20
+ and V
SS
DD
R1
10
REF
- pins following
Table
Figure
V
DD
19-2.
dsPIC30F6014A
19-2.
V
DD
Note 1: Ensure adequate bypass capacitors are provided on each V
V
DD
• Configure the ADC clock period to be:
• Configure the sampling time to be 1 T
The following figure shows the timing diagram of the
ADC running at 200 ksps. The T
tion with the guidelines described above allows a con-
version speed of 200 ksps. See
example.
by writing to the ADCS<5:0> control bits in the
ADCON3 register.
writing: SAMC<4:0> = 00001.
(14 + 1) x 200,000
V
V
60
59
58
57
56
55
54
53
52
50
49
DD
47
46
45
44
43
42
41
SS
1
V
See Note 1:
DD
C8
1 μF
C5
1 μF
V
AV
= 334 ns
DD
AD
DD
Example 19-1
C7
0.1 μF
C4
0.1 μF
selection in conjunc-
DS70143E-page 137
V
AV
DD
AD
DD
C6
0.01 μF
C3
0.01 μF
by
DD
for code
V
AV
DD
pin.
DD

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