DSPIC30F6012A-20E/PF Microchip Technology, DSPIC30F6012A-20E/PF Datasheet - Page 223

IC DSPIC MCU/DSP 144K 64TQFP

DSPIC30F6012A-20E/PF

Manufacturer Part Number
DSPIC30F6012A-20E/PF
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6012A-20E/PF

Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TQFP, 64-VQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
68
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6012A-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
APPENDIX A:
Revision A (January 2005)
Original data sheet for dsPIC30F6011A, 6012A, 6013A
and 6014A devices.
Revision B (September 2005)
Revision B of this data sheet reflects these changes:
• 12-Bit ADC allows up to 200 ksps sampling rate
• FRC Oscillator revised to allow tuning in ±0.75%
• Revised electrical characteristics:
Revision C (October 2006)
Revision C of this data sheet reflects these changes:
• BSRAM and SSRAM SFRs added for Data RAM
• Added INTTREG register (see
• Revised I
• Base Instruction CP1 removed from instruction
• Revised electrical characteristics:
© 2011 Microchip Technology Inc.
(see
sion Clock”
increments (see
lator (FRC)”
- Operating Current (I
- Idle Current (I
- Power-Down Current (I
- Brown-Out Reset (BOR) (see
- External Clock Timing Requirements (see
- PLL Clock Timing Specification (V
- PLL Jitter
- Internal FRC Jitter Accuracy and Drift (see
- 12-Bit ADC Module Specifications (see
- 12-Bit ADC Conversion Timing Requirements
protection (see
tion
“Interrupts”)
set (see
- Operating Current (I
- Idle Current (I
- Power-Down Current (I
- I/O Pin Input Specifications (see
- Brown-Out Reset (BOR) (see
- Watchdog Timer (see
Table
5.5 V) (see
Table
Table
(see
Feature”)
Section 19.6 “Selecting the ADC Conver-
Table
23-14)
23-18)
23-38)
Table
2
C Slave Addresses (see
(seeTable
and
and
23-39)
Table
21-2)
Section 3.2.7 “Data Ram Protec-
IDLE
IDLE
Section 20.2.5 “Fast RC Oscil-
Section 19.7 “ADC
Table
23-15)
) (see
) (see
REVISION HISTORY
dsPIC30F6011A/6012A/6013A/6014A
DD
DD
23-16)
20-4).
Table
) (see
) (see
PD
PD
Table
Table
)
)
(seeTable
(seeTable
23-21)
Section 5.0
Table
Table
Table
Table
23-6)
23-6)
Table
Table
DD
23-5)
23-5)
Speeds”),
23-11)
23-11)
= 2.5-
23-7)
23-7)
23-8)
15-1)
Revision D (March 2008)
This revision reflects these updates:
• Added FUSE Configuration Register (FICD)
• Removed erroneous statement regarding genera-
• Electrical Specifications:
• Preliminary marking removed from document
• Additional minor corrections throughout the
details (see
Registers”
tion of CAN receive errors (see
“Receive
- Resolved TBD values for parameters DO10,
- 10-bit High-Speed ADC t
- Parameter OS65 (Internal RC Accuracy) has
- Parameter DC12 (RAM Data Retention Volt-
- Parameter D134 (Erase/Write Cycle Time)
- Removed parameters OS62 (Internal FRC
- Parameter OS63 (Internal FRC Accuracy)
- Updated I/O Pin characteristics parameters
- Removed parameters DC27a, DC27b,
- Removed parameters CS77 and CS78
- Updated Min and Max values and Conditions
footer
document
DO16, DO20, and DO26 (see
ter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table
age) has been updated to include a Min value
(see
has been updated to include Min and Max
values and the Typ value has been removed
(see
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table
has been expanded to reflect multiple Min
and Max values for different temperatures
(see
DI19 and DI29 (see
DC47a, and DC47b (references to I
MIPs @ 3.3V) in
(references to T
Table 23-30
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for parame-
ter SY20 (see
Table
Table
Table
23-39)
23-19)
23-18)
Errors”)
Section 20.8 “Device Configuration
and
23-4)
23-12)
23-18)
Table
Table
FACL
Table 23-5
20-8)
Table
23-21)
and T
PDU
23-8)
RACL
and
timing parame-
Section 17.4.5
Table
DS70143E-page 223
@ 3.3V) in
Table 23-6
DD
23-9)
, 20

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