PIC32MX795F512L-80I/PF Microchip Technology, PIC32MX795F512L-80I/PF Datasheet - Page 235

• Manufacturer Part Number: PIC32MX795F512L-80I/PF
• Description: IC MCU 32BIT 512KB FLASH 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX795F512L-80I/PF

• Core Size: 32-Bit
• Program Memory Size: 512KB (512K x 8)
• Core Processor: MIPS32® M4K™
• Speed: 80MHz
• Connectivity: CAN, Ethernet, I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Type: FLASH
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP
• Controller Family/series: PIC32
• Ram Memory Size: 128KB
• Cpu Speed: 80MHz
• No. Of Timers: 5
• Interface: CAN, I2C, SPI, UART, USB
• No. Of Pwm Channels: 5
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Rohs Compliant: Yes
• Processor Series: PIC32MX7xx
• Core: MIPS
• 3rd Party Development Tools: 52713-733, 52714-737
• Development Tools By Supplier: PG164130, DV164035, DV244005
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

TABLE B-1:
 2009 Microchip Technology Inc.
Section 12.0 “I/O Ports”
Section 22.0 “10-bit Analog-to-
Digital Converter (ADC)”
Section 28.0 “Special Features”
Section 31.0 “Electrical
Characteristics”
Section 32.0 “Packaging
Information”
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated the second paragraph of Section 12.1.2 “Digital Inputs” and
removed Table 12-1.
Updated the ADC Conversion Clock Period Block Diagram (see Figure 22-2).
Removed references to the ENVREG pin in Section 28.3 “On-Chip Voltage
Regulator” .
Updated the first sentence of Section 28.3.1 “On-Chip Regulator and
POR” and Section 28.3.2 “On-Chip Regulator and BOR” .
Updated the Connections for the On-Chip Regulator (see Figure 28-2).
Updated the Absolute Maximum Ratings and added Note 3.
Added Thermal Packaging Characteristics for the 121-pin XBGA package
(see Table 31-3).
Updated the Operating Current (I
Updated the Idle Current (I
Updated the Power-Down Current (I
Removed Note 1 from the Program Flash Memory Wait State Characteristics
(see Table 31-11).
Updated the SPIx Module Slave Mode (CKE = 1 ) Timing Characteristics,
changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see
Figure 31-13).
Added the 121-pin XBGA package marking information and package details.
Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).
Added the definition for Speed.
Preliminary
PIC32MX5XX/6XX/7XX
IDLE
Update Description
) DC Characteristics (see Table 31-6).
DD
) DC Characteristics (see Table 31-5).
PD
) DC Characteristics (see Table 31-7).
DS61156B-page 235