LPC2103FBD48,118 NXP Semiconductors, LPC2103FBD48,118 Datasheet - Page 24

• Manufacturer Part Number: LPC2103FBD48,118
• Description: IC ARM7 MCU FLASH 32K 48-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2103FBD48,118

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 70MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, JTAG, SPI, SSP, UART
• Maximum Clock Frequency: 70 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DB-LQFP48-LPC2103, MCB2103, MCB2103U, MCB2103UME, KSK-LPC2103-01, KSK-LPC2103-01PL, KSK-LPC2103-02
• Development Tools By Supplier: OM10079, OM10081, OM10090
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: 568-4302 - BOARD EVAL LPC210X KS2103 JLINK568-4301 - BOARD EVAL LPC210X KS2103568-4300 - BOARD EVAL LPC210X MCB2103568-4297 - BOARD EVAL LPC21XX MCB2100MCB2103UME - BOARD EVAL MCB2103 + ULINK-MEMCB2103U - BOARD EVAL MCB2103 + ULINK2622-1013 - BOARD FOR LPC2103 48-LQFP622-1008 - BOARD FOR LPC9103 10-HVSONMCB2103 - BOARD EVAL NXP LPC2101/2101/2103
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 935280966118; LPC2103FBD48-T; LPC2103FBD48-T

NXP Semiconductors
Table 5.
T
LPC2101_02_03_4
Product data sheet
Symbol
I
I
I
I
V
V
V
V
I
Oscillator pins
V
pu
DD(CORE)
BAT
2
LI
amb
C-bus pins
IH
IL
hys
OL
i(XTAL1)
= 40 C to +85 C for commercial applications, unless otherwise specified.
Parameter
pull-up current
core supply current
battery supply
current
HIGH-level input
voltage
LOW-level input
voltage
hysteresis voltage
LOW-level output
voltage
input leakage
current
input voltage on pin
XTAL1
Static characteristics
Conditions
V
V
Active mode;
executed from flash; all peripherals
enabled via PCONP register but not
configured to run; CCLK = 70 MHz
Power-down mode;
Deep power-down mode;
RTC off; SRAM off; T
Active mode; CCLK = 70 MHz;
PCLK = 17.5 MHz;
PCLK enabled to RTCK;
RTC clock = 32 kHz (from RTCX
pins); T
Power-down mode;
RTC clock = 32 kHz
(from RTCX pins); T
Deep power-down mode;
RTC off; SRAM off; T
I
V
V
code
OLS
I
DD(3V3)
I
I
…continued
V
V
V
V
V
V
V
V
= 0 V
= V
= 5 V
DD(1V8)
DD(1V8)
DD(1V8)
i(VBAT)
DD(1V8)
DD(1V8)
DD(1V8)
DD(1V8)
while(1){}
= 3 mA
DD(3V3)
amb
< V
= 3.3 V; V
= 1.8 V; T
= 1.8 V; T
= 1.8 V; T
= 1.8 V; V
= 1.8 V; V
= 1.8 V; V
= 1.8 V; V
= 25 C
I
< 5 V
Rev. 04 — 2 June 2009
[12]
DD(1V8)
amb
amb
amb
amb
i(VBAT)
i(VBAT)
i(VBAT)
i(VBAT)
amb
amb
= 25 C
= 25 C
= 25 C
= 85 C
= 25 C
= 25 C
= 1.8 V
= 3.0 V
= 2.5 V
= 3.0 V
= 3.0 V
[13]
[10]
[15]
Single-chip 16-bit/32-bit microcontrollers
Min
0
-
-
-
-
[14]
-
-
-
-
0.7V
-
-
-
-
-
0
15
DD(3V3)
LPC2101/02/03
Typ
0
41
2.5
35
0.7
10
7
8
8
-
-
0.5V
-
2
10
-
50
[1]
DD(3V3)
© NXP B.V. 2009. All rights reserved.
Max
0
70
25
105
-
15
12
12
-
-
0.3V
-
0.4
4
22
1.8
85
DD(3V3)
24 of 37
Unit
mA
V
V
V
V
V
A
A
A
A
A
A
A
A
A
A
A