LPC2103FBD48,118 NXP Semiconductors, LPC2103FBD48,118 Datasheet - Page 31

• Manufacturer Part Number: LPC2103FBD48,118
• Description: IC ARM7 MCU FLASH 32K 48-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2103FBD48,118

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 70MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, JTAG, SPI, SSP, UART
• Maximum Clock Frequency: 70 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DB-LQFP48-LPC2103, MCB2103, MCB2103U, MCB2103UME, KSK-LPC2103-01, KSK-LPC2103-01PL, KSK-LPC2103-02
• Development Tools By Supplier: OM10079, OM10081, OM10090
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: 568-4302 - BOARD EVAL LPC210X KS2103 JLINK568-4301 - BOARD EVAL LPC210X KS2103568-4300 - BOARD EVAL LPC210X MCB2103568-4297 - BOARD EVAL LPC21XX MCB2100MCB2103UME - BOARD EVAL MCB2103 + ULINK-MEMCB2103U - BOARD EVAL MCB2103 + ULINK2622-1013 - BOARD FOR LPC2103 48-LQFP622-1008 - BOARD FOR LPC9103 10-HVSONMCB2103 - BOARD EVAL NXP LPC2101/2101/2103
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 935280966118; LPC2103FBD48-T; LPC2103FBD48-T

NXP Semiconductors
11. Package outline
Fig 10. Package outline SOT313-2 (LQFP48)
LPC2101_02_03_4
Product data sheet
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT313-2
max.
1.6
48
A
37
y
0.20
0.05
36
A
1
1
e
1.45
1.35
A
2
136E05
IEC
pin 1 index
0.25
b
A
p
3
H
D
D
0.27
0.17
b
w
p
M
0.18
0.12
c
X
MS-026
JEDEC
Z D
12
25
D
7.1
6.9
(1)
REFERENCES
B
24
13
E
7.1
6.9
0
Rev. 04 — 2 June 2009
(1)
Z E
b
0.5
e
e
w
p
M
JEITA
v
v
scale
2.5
9.15
8.85
H
M
M
D
A
B
A
E
9.15
8.85
H
H
E
E
5 mm
L
1
Single-chip 16-bit/32-bit microcontrollers
0.75
0.45
L
A
p
A
2
0.2
v
A
1
0.12
LPC2101/02/03
w
PROJECTION
EUROPEAN
detail X
0.1
y
Z
0.95
0.55
D
L
(1)
L
p
© NXP B.V. 2009. All rights reserved.
Z
0.95
0.55
E
ISSUE DATE
(1)
(A )
00-01-19
03-02-25
3
7
0
SOT313-2
o
o
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