LPC2368FET100,518 NXP Semiconductors, LPC2368FET100,518 Datasheet - Page 41

IC ARM7 MCU FLASH 512K 100TFBGA

LPC2368FET100,518

Manufacturer Part Number
LPC2368FET100,518
Description
IC ARM7 MCU FLASH 512K 100TFBGA
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2368FET100,518

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-TFBGA
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
58K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
58 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100, MCB2360, MCB2360U, MCB2360UME
Development Tools By Supplier
OM10095, OM11042
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
100TFBGA
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4917 - DEVELOPMENT BOARD FOR LPC2368622-1022 - BOARD SCKT ADAPTER FOR TFBGA100MCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2622-1019 - BOARD FOR LPC2106 48-LQFP568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
935285102518
LPC2368FET100-T
LPC2368FET100-T

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2368FET100,518
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
9.1 Power-down mode
Fig 5.
Fig 6.
I
DD(IO)
(μA)
(μA)
I
BAT
−2
−4
40
30
20
10
V
I/O maximum supply current I
RTC battery maximum supply current I
mode
V
4
2
0
0
−40
i(VBAT)
−40
DD(3V3)
= V
= V
DD(DCDC)(3V3)
DD(DCDC)(3V3)
Rev. 06 — 1 February 2010
−15
−15
V
V
i(VBAT)
i(VBAT)
= 3.3 V; T
= 3.3 V; T
= 3.3 V
= 3.0 V
amb
10
10
DD(IO)
amb
= 25 °C.
= 25 °C.
versus temperature in Power-down mode
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
BAT
V
V
versus temperature in Power-down
DD(3V3)
DD(3V3)
35
35
= 3.3 V
= 3.0 V
60
60
temperature (°C)
temperature (°C)
002aae049
002aae050
© NXP B.V. 2010. All rights reserved.
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