LPC2368FET100,518 NXP Semiconductors, LPC2368FET100,518 Datasheet - Page 6

• Manufacturer Part Number: LPC2368FET100,518
• Description: IC ARM7 MCU FLASH 512K 100TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2368FET100,518

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 58K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 58 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100, MCB2360, MCB2360U, MCB2360UME
• Development Tools By Supplier: OM10095, OM11042
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 100TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4917 - DEVELOPMENT BOARD FOR LPC2368622-1022 - BOARD SCKT ADAPTER FOR TFBGA100MCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2622-1019 - BOARD FOR LPC2106 48-LQFP568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935285102518; LPC2368FET100-T; LPC2368FET100-T

NXP Semiconductors
6. Pinning information
Table 3.
LPC2364_65_66_67_68_6
Product data sheet
Pin Symbol
Row A
1
5
9
Row B
1
TDO
P1[10]/ENET_RXD1
P0[7]/I2STX_CLK/
SCK1/MAT2[1]
TMS
Pin allocation table
6.1 Pinning
Fig 2.
Fig 3.
Pin Symbol
2
6
10
2
LPC2364/68 pinning TFBGA100 package
LPC2364/65/66/67/68 pinning
P0[3]/RXD0
P1[16]/ENET_MDC
P0[9]/I2STX_SDA/
MOSI1/MAT2[3]
RTCK
Rev. 06 — 1 February 2010
ball A1
index area
25
G
C
D
H
A
B
E
F
K
1
J
LPC2364FET100/LPC2368FET100
Pin Symbol
3
7
11
3
1
LPC2364FBD100
LPC2365FBD100
LPC2366FBD100
LPC2367FBD100
LPC2368FBD100
2
V
V
-
V
DD(3V3)
DD(DCDC)(3V3)
SS
3
Transparent top view
4
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
5
6
7
002aac576
75
8
51
002aad225
9
10
Pin Symbol
4
8
12
4
P1[4]/ENET_TX_EN
P0[4]/I2SRX_CLK/
RD2/CAP2[0]
-
P1[1]/ENET_TXD1
© NXP B.V. 2010. All rights reserved.
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