LPC2468FET208,551 NXP Semiconductors, LPC2468FET208,551 Datasheet - Page 73

• Manufacturer Part Number: LPC2468FET208,551
• Description: IC ARM7 MCU FLASH 512K 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2468FET208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2S/ISP/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 6
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
• Development Tools By Supplier: OM10100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4262; 935283234551; LPC2468FET208-S

NXP Semiconductors
LPC2468
Product data sheet
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in
Table 18
and the capacitances C
fundamental mode oscillation (the fundamental frequency is represented by L, C
R
not be larger than 7 pF. Parameters F
manufacturer.
Table 18.
Fundamental oscillation
frequency F
1 MHz to 5 MHz
5 MHz to 10 MHz
10 MHz to 15 MHz
15 MHz to 20 MHz
Fig 28. Oscillator modes and models: oscillation mode of operation and external crystal
S
). Capacitance C
27), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
and
model used for C
Recommended values for C
components parameters): low frequency mode
OSC
Table
All information provided in this document is subject to legal disclaimers.
XTALIN
P
C X1
19. Since the feedback resistance is integrated on chip, only a crystal
LPC2xxx
in
Rev. 5 — 15 October 2010
Figure 28
X1
XTAL
X1
and C
Crystal load
capacitance C
10 pF
20 pF
30 pF
10 pF
20 pF
30 pF
10 pF
20 pF
10 pF
/C
X2
XTALOUT
X2
evaluation
C X2
represents the parallel package capacitance and should
need to be connected externally in case of
OSC
X1
/C
L
, C
X2
in oscillation mode (crystal and external
L
Maximum crystal
series resistance R
< 300 Ω
< 300 Ω
< 300 Ω
< 300 Ω
< 200 Ω
< 100 Ω
< 160 Ω
< 60 Ω
< 80 Ω
, R
S
and C
=
P
Single-chip 16-bit/32-bit micro
are supplied by the crystal
S
L
C L
R S
External load
capacitors C
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
002aaf494
LPC2468
© NXP B.V. 2010. All rights reserved.
C P
Figure 28
L
X1
and
/C
and in
73 of 85
X2