LH7A400N0G000B5;55 NXP Semiconductors, LH7A400N0G000B5;55 Datasheet - Page 64

IC ARM9 BLUESTREAK MCU 256BGA

LH7A400N0G000B5;55

Manufacturer Part Number
LH7A400N0G000B5;55
Description
IC ARM9 BLUESTREAK MCU 256BGA
Manufacturer
NXP Semiconductors
Series
BlueStreak ; LH7Ar
Datasheet

Specifications of LH7A400N0G000B5;55

Core Size
16/32-Bit
Core Processor
ARM9
Speed
200MHz
Connectivity
EBI/EMI, IrDA, Microwire, MMC, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals
AC'97, DMA, LCD, POR, PWM, WDT
Number Of I /o
60
Program Memory Type
ROMless
Ram Size
80K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Controller Family/series
(ARM9)
No. Of I/o's
60
Ram Memory Size
80KB
Cpu Speed
200MHz
No. Of Timers
3
No. Of Pwm Channels
2
Digital Ic Case Style
BGA
Processor Series
LH7A4
Core
ARM9TDMI
Data Bus Width
32 bit
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details
Other names
568-4334
935285038557
ANNEX A: Disclaimers (11)
1. t001dis100.fm: General (DS, AN, UM)
General — Information in this document is believed to be accurate and reliable. However, NXP
Semiconductors does not give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability for the consequences of
use of such information.
2. t001dis101.fm: Right to make changes (DS, AN, UM)
Right to make changes — NXP Semiconductors reserves the right to make changes to
information published in this document, including without limitation specifications and product
descriptions, at any time and without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
3. t001dis102.fm: Suitability for use (DS, AN, UM)
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted
to be suitable for use in medical, military, aircraft, space or life support equipment, nor in
applications where failure or malfunction of a NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe property or environmental damage. NXP
Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in
such equipment or applications and therefore such inclusion and/or use is at the customer’s own
risk.
4. t001dis103.fm: Applications (DS, AN, UM)
Applications — Applications that are described herein for any of these products are for
illustrative purposes only. NXP Semiconductors makes no representation or warranty that such
applications will be suitable for the specified use without further testing or modification.
5. t001dis104.fm: Limiting values (DS)
Limiting values — Stress above one or more limiting values (as defined in the Absolute
Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting
values are stress ratings only and operation of the device at these or any other conditions above
those given in the Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
6. t001dis105.fm: Terms and conditions of sale (DS)
Terms and conditions of sale — NXP Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms,
including those pertaining to warranty, intellectual property rights infringement and limitation of
liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any
inconsistency or conflict between information in this document and such terms and conditions, the
latter will prevail.

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