ST72F324J6T6 STMicroelectronics, ST72F324J6T6 Datasheet - Page 155

IC MCU 8BIT 32K 44-TQFP

ST72F324J6T6

Manufacturer Part Number
ST72F324J6T6
Description
IC MCU 8BIT 32K 44-TQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheets

Specifications of ST72F324J6T6

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Controller Family/series
ST7
No. Of I/o's
32
Ram Memory Size
1KB
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
No. Of Pwm Channels
1
Rohs Compliant
Yes
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
1024 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
4 bit
Operating Supply Voltage
3.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7F521-IND/USB, ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Cpu Family
ST7
Device Core Size
8b
Frequency (max)
8MHz
Total Internal Ram Size
1KB
# I/os (max)
32
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
3.8V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
TQFP
For Use With
497-8222 - UPS (LINE INTERACTIVE - 450W)497-8436 - BOARD EVAL UPS 450W VOUT=220V497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
In Transition
Other names
497-2108

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ST72324Bxx
12.8
12.8.1
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional electromagnetic susceptibility (EMS)
Based on a simple running application on the product (toggling two LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
A device reset allows normal operations to be resumed. The test results given in
on page 156
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the reset pin or the oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A burst of fast transient voltage (positive and negative) is applied to V
through a 100 pF capacitor, until a functional disturbance occurs. This test conforms
with the IEC 1000-4-4 standard.
corrupted program counter
unexpected reset
critical data corruption (control registers...)
are based on the EMS levels and classes defined in application note AN1709.
Electrical characteristics
DD
Table 102
and V
155/193
SS

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