ST72F324J6T6 STMicroelectronics, ST72F324J6T6 Datasheet - Page 23

IC MCU 8BIT 32K 44-TQFP

ST72F324J6T6

Manufacturer Part Number
ST72F324J6T6
Description
IC MCU 8BIT 32K 44-TQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheets

Specifications of ST72F324J6T6

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Controller Family/series
ST7
No. Of I/o's
32
Ram Memory Size
1KB
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
No. Of Pwm Channels
1
Rohs Compliant
Yes
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
1024 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
4 bit
Operating Supply Voltage
3.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7F521-IND/USB, ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Cpu Family
ST7
Device Core Size
8b
Frequency (max)
8MHz
Total Internal Ram Size
1KB
# I/os (max)
32
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
3.8V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
TQFP
For Use With
497-8222 - UPS (LINE INTERACTIVE - 450W)497-8436 - BOARD EVAL UPS 450W VOUT=220V497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
In Transition
Other names
497-2108

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ST72324Bxx
4
4.1
4.2
4.3
Flash program memory
Introduction
The ST7 dual voltage High Density Flash (HDFlash) is a non-volatile memory that can be
electrically erased as a single block or by individual sectors and programmed on a byte-by-
byte basis using an external V
The HDFlash devices can be programmed and erased off-board (plugged in a programming
tool) or on-board using ICP (in-circuit programming) or IAP (in-application programming).
The array matrix organization allows each sector to be erased and reprogrammed without
affecting other sectors.
Main features
Structure
The Flash memory is organized in sectors and can be used for both code and data storage.
Depending on the overall Flash memory size in the microcontroller device, there are up to
three user sectors
unnecessary erasing of the whole Flash memory when only a partial erasing is required.
The first two sectors have a fixed size of 4 Kbytes (see
upper part of the ST7 addressing space so the reset and interrupt vectors are located in
Sector 0 (F000h-FFFFh).
Table 4.
3 Flash programming modes:
ICT (in-circuit testing) for downloading and executing user application test patterns in
RAM
Readout protection
Register Access Security System (RASS) to prevent accidental programming or
erasing
Insertion in a programming tool. In this mode, all sectors including option bytes
can be programmed or erased.
ICP (in-circuit programming). In this mode, all sectors including option bytes can
be programmed or erased without removing the device from the application board.
IAP (in-application programming). In this mode, all sectors, except Sector 0, can
be programmed or erased without removing the device from the application board
and while the application is running.
Sectors available in Flash devices
Flash size
>8 Kbytes
(seeTable
4 Kbytes
8 Kbytes
4). Each of these sectors can be erased independently to avoid
PP
supply.
Figure
Available sectors
Sectors 0, 1, 2
7). They are mapped in the
Sectors 0, 1
Sector 0
Flash program memory
23/193

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