STM32F103RBH6 STMicroelectronics, STM32F103RBH6 Datasheet - Page 13

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STM32F103RBH6

Manufacturer Part Number
STM32F103RBH6
Description
MCU ARM 32BIT 128KB FLASH 64BGA
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F103RBH6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-BGA
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
20 KB
Interface Type
CAN, I2C, SPI, USART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32-JL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ST-LINK
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (12 bit, 16 Channel)
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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STM32F103x8, STM32F103xB
2.2
Full compatibility throughout the family
The STM32F103xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are
identified as low-density devices, the STM32F103x8 and STM32F103xB are referred to as
medium-density devices, and the STM32F103xC, STM32F103xD and STM32F103xE are
referred to as high-density devices.
Low- and high-density devices are an extension of the STM32F103x8/B devices, they are
specified in the STM32F103x4/6 and STM32F103xC/D/E datasheets, respectively. Low-
density devices feature lower Flash memory and RAM capacities, less timers and
peripherals. High-density devices have higher Flash memory and RAM capacities, and
additional peripherals like SDIO, FSMC, I
the other members of the STM32F103xx family.
The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD and STM32F103xE
are a drop-in replacement for STM32F103x8/B medium-density devices, allowing the user
to try different memory densities and providing a greater degree of freedom during the
development cycle.
Moreover, the STM32F103xx performance line family is fully compatible with all existing
STM32F101xx access line and STM32F102xx USB access line devices.
Table 3.
1. For orderable part numbers that do not show the A internal code after the temperature range code (6 or 7),
Pinout
144
100
64
48
36
the reference datasheet for electrical characteristics is that of the STM32F103x8/B medium-density
devices.
2 × USARTs
2 × 16-bit timers
1 × SPI, 1 × I
CAN, 1 × PWM timer
2 × ADCs
6 KB RAM 10 KB RAM 20 KB RAM 20 KB RAM 48 KB RAM 64 KB RAM 64 KB RAM
Low-density devices
16 KB
Flash
STM32F103xx family
2
C, USB,
Flash
32 KB
(1)
Doc ID 13587 Rev 13
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I
CAN, 1 × PWM timer
2 × ADCs
Medium-density devices
64 KB
Flash
2
S and DAC, while remaining fully compatible with
2
Cs, USB,
128 KB
Flash
5 × USARTs
4 × 16-bit timers, 2 × basic timers
3 × SPIs, 2 × I
USB, CAN, 2 × PWM timers
3 × ADCs, 2 × DACs, 1 × SDIO
FSMC (100 and 144 pins)
256 KB
Flash
High-density devices
2
Ss, 2 × I2Cs
384 KB
Flash
Description
512 KB
Flash
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