STM32F103RBH6 STMicroelectronics, STM32F103RBH6 Datasheet - Page 75

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STM32F103RBH6

Manufacturer Part Number
STM32F103RBH6
Description
MCU ARM 32BIT 128KB FLASH 64BGA
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F103RBH6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-BGA
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
20 KB
Interface Type
CAN, I2C, SPI, USART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32-JL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ST-LINK
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (12 bit, 16 Channel)
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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STM32F103x8, STM32F103xB
Table 49.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
4. Based on characterization, not tested in production.
Figure 36. ADC accuracy characteristics
4095
4094
4093
Symbol
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
7
6
5
4
3
2
1
0
V
SSA
[1LSB
1
E
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
IDEAL
O
ADC accuracy
2
=
V
4096
3
REF+
Parameter
4
(or
V
5
1 LSB
4096
DDA
E
6
(1) (2) (3)
T
depending on package)]
IDEAL
Doc ID 13587 Rev 13
E
7
L
(2)
f
f
V
Measurements made after
ADC calibration
E
PCLK2
ADC
D
DDA
4093 4094 4095 4096
(3)
= 14 MHz, R
= 2.4 V to 3.6 V
= 56 MHz,
Test conditions
DD
(1)
, frequency and temperature ranges.
E
INJ(PIN)
G
V
DDA
AIN
and ΣI
< 10 kΩ,
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
=Differential Linearity Error: maximum deviation
INJ(PIN)
Electrical characteristics
in
±1.5
±1.5
±1.5
Typ
±2
±1
Section 5.3.12
Max
±2.5
±3
±2
±5
±3
(4)
does not
ai14395b
Unit
LSB
75/99

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