STR912FAW47X6 STMicroelectronics, STR912FAW47X6 Datasheet - Page 21

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STR912FAW47X6

Manufacturer Part Number
STR912FAW47X6
Description
MCU ARM9 2048KB FLASH 128LQFP
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet

Specifications of STR912FAW47X6

Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
2MB (2M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Processor Series
STR912x
Core
ARM966E-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
96 KB
Interface Type
CAN, I2C, IrDA, SSP, UART, USB
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
80
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
STR9
Device Core
ARM966E-S
Device Core Size
16/32Bit
Frequency (max)
96MHz
Total Internal Ram Size
96KB
# I/os (max)
80
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
2/3.6V
Operating Supply Voltage (min)
1.65/1.77/2.5/2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
128
Package Type
LQFP
For Use With
MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-9039
STR912FAW47X6

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STR91xFAxxx
3.10.2
3.10.3
3.10.4
As an option, there are a number of peripherals that do not have to receive a clock sourced
from the CCU. The USB interface can receive an external clock on pin P2.7, TIM timers
TIM0/ TIM1 can receive an external clock on pin P2.4, and timers TIM2/TIM3 on pin P2.5.
Figure 2.
Reference clock (RCLK)
The main clock (f
(RCLK) for the ARM core and all the peripherals. The RCLK provides the divided clock for
the ARM core, and feeds the dividers for the AHB, APB, External Memory Interface, and
FMI units.
AHB clock (HCLK)
The RCLK can be divided by 1, 2 or 4 to generate the AHB clock. The AHB clock is the bus
clock for the AHB bus and all bus transfers are synchronized to this clock. The maximum
HCLK frequency is 96 MHz.
APB clock (PCLK)
The RCLK can be divided by 1, 2, 4 or 8 to generate the APB clock. The APB clock is the
bus clock for the APB bus and all bus transfers are synchronized to this clock. Many of the
peripherals that are connected to the AHB bus also use the PCLK as the source for external
bus data transfers. The maximum PCLK frequency is 48 MHz.
EXTCLK_T2T3
EXTCLK_T0T1
USB_CLK48M
MII_PHYCLK
X1_CPU
X1_RTC
X1_CPU
X2_RTC
JRTCLK
4-25MHz
Clock control
32.768 kHz
48MHz
25MHz
MSTR
Main
OSC
RTC
OSC
) can be divided to operate at a slower frequency reference clock
External clock
Timer 2 & 3
External clock
Timer 0 & 1
f
OSC
32.768 kHz
Doc ID 13495 Rev 6
f
RTC
RTCSEL
PHYSEL
PLL
f
PLL
Master CLK
f
MSTR
(1,2,4,8,16,1024)
1/2
1/2
RCLK
DIV
USBCLK to USB
BRCLK to SSPs and UARTs
Functional overview
RCLK
1/2
1/2
AHB DIV
APB DIV)
(1,2,4)
(1,2,4,8)
CPUCLK
FMICLK
EMI_BCLK
21/102
PCLK
HCLK

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