MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 33

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MC9S12XET256MAL

Manufacturer Part Number
MC9S12XET256MAL
Description
MCU 16BIT 256K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XET256MAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 12x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Cpu Family
HCS12X
Device Core Size
16b
Frequency (max)
50MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
16KB
# I/os (max)
91
Number Of Timers - General Purpose
25
Operating Supply Voltage (typ)
1.8/2.8/5V
Operating Supply Voltage (max)
1.98/2.9/5.5V
Operating Supply Voltage (min)
1.72/2.7/3.13V
On-chip Adc
16-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
16KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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1.1.4
Table 1-1
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
shows the device register memory map.
Device Memory Map
0x000C–0x000D
0x00C0–0x00C7
0x00C8–0x00CF
0x00D0–0x00D7
0x00D8–0x00DF
0x000A–0x000B
0x001A–0x001B
0x001C–0x001F
0x00B0–0x00B7
0x00B8–0x00BF
0x00E0–0x00E7
0x00E8–0x00EF
0x01C0–0x01FF
0x000E–0x000F
0x0020–0x002F
0x0034–0x003F
0x0040–0x007F
0x0080–0x00AF
0x00F0–0x00F7
0x00F8–0x00FF
0x0114–0x011F
0x0120–0x012F
0x0138–0x013F
0x0140–0x017F
0x0180–0x01BF
0x0000–0x0009
0x0010–0x0017
0x0018–0x0019
0x0030–0x0031
0x0032–0x0033
0x0100–0x0113
0x0130–0x0137
Address
MC9S12XE-Family Reference Manual Rev. 1.23
Table 1-1. Device Register Memory Map
PIM (port integration module
MMC (memory map control)
PIM (port integration module)
EBI (external bus interface)
MMC (memory map control)
Reserved
Device ID register
PIM (port integration module)
DBG (debug module)
Reserved
PIM (port integration module)
ECRG (clock and reset generator)
ECT (enhanced capture timer 16-bit 8-channel)s
ATD1 (analog-to-digital converter 12-bit 16-channel)
IIC1 (inter IC bus)
SCI2 (serial communications interface)
SCI3 (serial communications interface)
SCI0 (serial communications interface)
SCI1 (serial communications interface)
SPI0 (serial peripheral interface)
IIC0 (inter IC bus)
Reserved
SPI1 (serial peripheral interface)
SPI2 (serial peripheral interface)
FTM control registers
MPU (memory protection unit)
INT (interrupt module)
SCI4 (serial communications interface)
SCI5 (serial communications interface)
CAN0
CAN1
CAN2
Module
)
Chapter 1 Device Overview MC9S12XE-Family
(Bytes)
Size
10
16
12
64
48
20
12
16
64
64
64
2
2
2
8
2
2
4
2
2
8
8
8
8
8
8
8
8
8
8
8
8
33

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