MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 887
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MC9S12XET256MAL
Manufacturer Part Number
MC9S12XET256MAL
Description
MCU 16BIT 256K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XEP768CAL.pdf
(1328 pages)
Specifications of MC9S12XET256MAL
Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 12x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Cpu Family
HCS12X
Device Core Size
16b
Frequency (max)
50MHz
Interface Type
CAN/SCI/SPI
Total Internal Ram Size
16KB
# I/os (max)
91
Number Of Timers - General Purpose
25
Operating Supply Voltage (typ)
1.8/2.8/5V
Operating Supply Voltage (max)
1.98/2.9/5.5V
Operating Supply Voltage (min)
1.72/2.7/3.13V
On-chip Adc
16-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
16KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XET256MAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XET256MAL
Manufacturer:
FREESCALE
Quantity:
20 000
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24.4.2.21 Partition D-Flash Command
The Partition D-Flash command allows the user to allocate sectors within the D-Flash block for
applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 32
sectors with 256 bytes per sector. The Erase All Blocks command must be run prior to launching the
Partition D-Flash command.
Upon clearing CCIF to launch the Partition D-Flash command, the following actions are taken to define a
partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for
EEE use (ERPART):
Freescale Semiconductor
•
•
•
•
FERSTAT
Register
Validate the DFPART and ERPART values provided:
— DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block)
— ERPART <= 8 (maximum number of 256 byte sectors in buffer RAM)
— If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash
— If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to
Erase verify the D-Flash block and the EEE nonvolatile information register
Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see
Table
Program a duplicate DFPART to the EEE nonvolatile information register at global address
0x12_0002 (see
FSTAT
block required to support EEE)
buffer RAM EEE space to support EEE)
24-7)
CCOBIX[2:0]
Table 24-74. EEPROM Emulation Query Command Error Handling
Table 24-75. Partition D-Flash Command FCCOB Requirements
000
001
010
MGSTAT1
MGSTAT0
EPVIOLIF
ACCERR
Error Bit
FPVIOL
Table
24-7)
Number of 256 byte sectors for the D-Flash user partition (DFPART)
Number of 256 byte sectors for buffer RAM EEE partition (ERPART)
MC9S12XE-Family Reference Manual , Rev. 1.23
Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see
None
None
None
None
0x20
FCCOB Parameters
Error Condition
Chapter 24 128 KByte Flash Module (S12XFTM128K2V1)
Not required
Table
24-30)
887
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