MC9S12XET256MAL Freescale Semiconductor, MC9S12XET256MAL Datasheet - Page 72

• Manufacturer Part Number: MC9S12XET256MAL
• Description: MCU 16BIT 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XET256MAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 112-LQFP
• Cpu Family: HCS12X
• Device Core Size: 16b
• Frequency (max): 50MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 16KB
• # I/os (max): 91
• Number Of Timers - General Purpose: 25
• Operating Supply Voltage (typ): 1.8/2.8/5V
• Operating Supply Voltage (max): 1.98/2.9/5.5V
• Operating Supply Voltage (min): 1.72/2.7/3.13V
• On-chip Adc: 16-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 1 Device Overview MC9S12XE-Family
1.2.3.76
PS0 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial
communication interface 0 (SCI0).
1.2.3.77
PT[7:6] are general-purpose input or output pins. They can be configured as input capture or output
compare pins IOC[7:6] of the enhanced capture timer (ECT).
1.2.3.78
PT[5] is a general-purpose input or output pin. It can be configured as input capture or output compare pin
IOC[5] of the enhanced capture timer (ECT) or can be configured to output the VREG_API signal.
1.2.3.79
PT[4:0] are general-purpose input or output pins. They can be configured as input capture or output
compare pins IOC[4:0] of the enhanced capture timer (ECT).
1.2.4
MC9S12XE-Family power and ground pins are described below.
Because fast signal transitions place high, short-duration current demands on the power supply, use bypass
capacitors with high-frequency characteristics and place them as close to the MCU as possible.
1.2.4.1
External power and ground for I/O drivers. Bypass requirements depend on how heavily the MCU pins are
loaded. All V
1.2.4.2
Input to the internal voltage regulator. The internal voltage regulator is turned off, if V
1.2.4.3
Power is supplied to the MCU core from the internal voltage regulator, whose load capacitor must be
connected to VDD. The voltage supply of nominally 1.8V is derived from the internal voltage regulator.
The return current path is through the VSS1,VSS2 and VSS3 pins. No static external loading of these pins
is permitted.
72
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
Power Supply Pins
PS0 / RXD0 — Port S I/O Pin 0
PT[7:6] / IOC[7:6] — Port T I/O Pins [7:6]
PT[5] / IOC[5] / VREG_API— Port T I/O Pins [5]
PT[4:0] / IOC[4:0] — Port T I/O Pins [4:0]
VDDX[7:1], VSSX[7:1] — Power and Ground Pins for I/O Drivers
DDX
VDDR — Power Pin for Internal Voltage Regulator
VDD, VSS1,VSS2,VSS3 — Core Power Pins
All V
pins are connected together internally. All V
SS
pins must be connected together in the application.
MC9S12XE-Family Reference Manual , Rev. 1.23
NOTE
SSX
pins are connected together internally.
Freescale Semiconductor
DDR
is tied to ground