HD64F3642AH Renesas Electronics America, HD64F3642AH Datasheet - Page 132
![IC H8 MCU FLASH 16K 64QFP](/photos/28/61/286103/64-bqfp__prqp0064gb-a_sml.jpg)
HD64F3642AH
Manufacturer Part Number
HD64F3642AH
Description
IC H8 MCU FLASH 16K 64QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Lr
Datasheet
1.HD64F3644HV.pdf
(551 pages)
Specifications of HD64F3642AH
Core Processor
H8/300L
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
PWM, WDT
Number Of I /o
53
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Section 6 ROM
6.3.3
A highly effective way to improve data retention characteristics is to bake the programmed chips
at 150°C, then screen them for data errors. This procedure quickly eliminates chips with PROM
memory cells prone to early failure.
Figure 6.5 shows the recommended screening procedure.
If a group of programming errors occurs while the same PROM programmer is in use, stop
programming and check the PROM programmer and socket adapter for defects, using a
microcomputer with on-chip EPROM in a windowed package, etc. Please inform Renesas
Technology of any abnormal conditions noted during or after programming or in screening of
program data after high-temperature baking.
Rev. 6.00 Sep 12, 2006 page 110 of 526
REJ09B0326-0600
Avoid touching the socket adapter or chip while programming, since this may cause contact
faults and write errors.
Reliability of Programmed Data
Figure 6.5 Recommended Screening Procedure
Bake chip for 24 to 48 hours
Read and check program
verify programmed data
Program chip and
at 125 C to 150 C
with power off
Install
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