HD64F3642AH Renesas Electronics America, HD64F3642AH Datasheet - Page 334
![IC H8 MCU FLASH 16K 64QFP](/photos/28/61/286103/64-bqfp__prqp0064gb-a_sml.jpg)
HD64F3642AH
Manufacturer Part Number
HD64F3642AH
Description
IC H8 MCU FLASH 16K 64QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Lr
Datasheet
1.HD64F3644HV.pdf
(551 pages)
Specifications of HD64F3642AH
Core Processor
H8/300L
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
PWM, WDT
Number Of I /o
53
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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HD64F3642AHV H8/3642A
Manufacturer:
RENESAS
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- Current page: 334 of 551
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Section 10 Serial Communication Interface
RXD pin
TXD pin
TXD pin
Rev. 6.00 Sep 12, 2006 page 312 of 526
REJ09B0326-0600
TDR (next transmit data)
TSR (transmission in progress)
TDR
TSR (transmission in progress)
RDR
RSR (reception in progress)
TDRE = 0
TEND = 0
RDRF = 0
Figure 10.7 (a) RDRF Setting and RXI Interrupt
Figure 10.7 (b) TDRE Setting and TXI Interrupt
Figure 10.7 (c) TEND Setting and TEI Interrupt
TXD pin
RXD pin
TXD pin
TDR
TSR (transmission completed, transfer)
RDR
RSR (reception completed, transfer)
TDRE
(TXI request when TIE = 1)
RDRF
(RXI request when RIE = 1)
TDR
TSR (reception completed)
TEND
(TEI request when TEIE = 1)
1
1
1
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