DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 186

MCU 3V 128K 100-TQFP

DF2317VTE25

Manufacturer Part Number
DF2317VTE25
Description
MCU 3V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2317VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
79
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2317VTE25
HD64F2317VTE25

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2317VTE25V
Manufacturer:
AD
Quantity:
3 643
Part Number:
DF2317VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
6.3
6.3.1
In advanced mode, the bus controller partitions the 16-Mbyte address space into eight areas, 0 to
7, in 2-Mbyte units, and performs bus control for external space in area units. Figure 6.2 shows an
outline of the area partitioning.
Chip select signals (CS0 to CS7) can be output for each area.
Rev.7.00 Feb. 14, 2007 page 152 of 1108
REJ09B0089-0700
Overview of Bus Control
Area Partitioning
Figure 6.2 Overview of Area Partitioning
H'000000
H'1FFFFF
H'200000
H'3FFFFF
H'400000
H'5FFFFF
H'600000
H'7FFFFF
H'800000
H'9FFFFF
H'A00000
H'BFFFFF
H'C00000
H'DFFFFF
H'E00000
H'FFFFFF
Advanced mode
(2 Mbytes)
(2 Mbytes)
(2 Mbytes)
(2 Mbytes)
(2 Mbytes)
(2 Mbytes)
(2 Mbytes)
(2 Mbytes)
Area 0
Area 1
Area 2
Area 3
Area 4
Area 5
Area 6
Area 7

Related parts for DF2317VTE25