DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 235

MCU 3V 128K 100-TQFP

DF2317VTE25

Manufacturer Part Number
DF2317VTE25
Description
MCU 3V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2317VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
79
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2317VTE25
HD64F2317VTE25

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Part Number:
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Manufacturer:
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7.3.4
Figure 7.5 shows how the register information should be located in the address space.
Locate the MRA, SAR, MRB, DAR, CRA, and CRB registers, in that order, from the start address
of the register information (contents of the vector address). In the case of chain transfer, register
information should be located in consecutive areas.
Locate the register information in the on-chip RAM (addresses: H'FFF800 to H'FFFBFF).
Figure 7.4 Correspondence between DTC Vector Address and Register Information
DTC vector
address
Location of Register Information in Address Space
Register
information
start address
Chain
transfer
Figure 7.5 Location of DTC Register Information in Address Space
Register information
start address
MRA
MRB
MRA
MRB
0
CRA
CRA
Lower address
1
4 bytes
DAR
SAR
DAR
SAR
2
Next transfer
CRB
CRB
Rev.7.00 Feb. 14, 2007 page 201 of 1108
3
Section 7 Data Transfer Controller
Register information
Register information
for 2nd transfer in
chain transfer
Register information
REJ09B0089-0700

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