DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 242

MCU 3V 128K 100-TQFP

DF2317VTE25

Manufacturer Part Number
DF2317VTE25
Description
MCU 3V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2317VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
79
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2317VTE25
HD64F2317VTE25

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Part Number
Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
AD
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Part Number:
DF2317VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
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Section 7 Data Transfer Controller
7.3.10
Table 7.9 lists execution phases for a single DTC data transfer, and table 7.10 shows the number
of states required for each execution phase.
Table 7.9
Mode
Normal
Repeat
Block transfer
Rev.7.00 Feb. 14, 2007 page 208 of 1108
REJ09B0089-0700
φ
DTC activation
request
DTC
request
Address
Number of DTC Execution States
DTC Execution Phases
Figure 7.12 DTC Operation Timing (Example of Chain Transfer)
Vector Read
I
1
1
1
Vector read
Register Information
Read/Write
J
6
6
6
information
Transfer
read
Data transfer
Read Write
N: Block size (initial setting of CRAH and CRAL)
information
Transfer
Data Read
K
1
1
N
write
information
Transfer
read
Data Write
L
1
1
N
Data transfer
Read Write
information
Transfer
Internal
Operations
M
3
3
3
write

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