MC9S08RD32CPE Freescale Semiconductor, MC9S08RD32CPE Datasheet - Page 188

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MC9S08RD32CPE

Manufacturer Part Number
MC9S08RD32CPE
Description
IC MCU 32K FLASH 2K RAM 28-DIP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08RD32CPE

Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Development Support
Figure 15-4
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the start of the bit time as perceived by the target MCU. The host initiates the bit time but the
target HCS08 finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD pin low
for 13 BDC clock cycles, then briefly drives it high to speed up the rising edge. The host samples the bit
level about 10 cycles after starting the bit time.
188
SPEED-UP PULSE
PERCEIVED START
TO BKGD PIN
TARGET MCU
(TARGET MCU)
HOST DRIVE
DRIVE AND
BDC CLOCK
OF BIT TIME
BKGD PIN
shows the host receiving a logic 0 from the target HCS08 MCU. Because the host is
Figure 15-4. BDM Target-to-Host Serial Bit Timing (Logic 0)
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
10 CYCLES
HOST SAMPLES BKGD PIN
10 CYCLES
HIGH-IMPEDANCE
SPEEDUP
PULSE
EARLIEST START
OF NEXT BIT
Freescale Semiconductor

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