MC9S08RD32CPE Freescale Semiconductor, MC9S08RD32CPE Datasheet - Page 212

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MC9S08RD32CPE

Manufacturer Part Number
MC9S08RD32CPE
Description
IC MCU 32K FLASH 2K RAM 28-DIP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08RD32CPE

Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Electrical Characteristics
A.8
A.9
This section describes ac timing characteristics for each peripheral system.
A.9.1
1. This is the shortest pulse that is guaranteed to be recognized as a reset pin request. Shorter pulses are not guaranteed to
212
Bus frequency (t
Real time interrupt internal oscillator period
External reset pulse width
Reset low drive
Active background debug mode latch setup time
Active background debug mode latch hold time
IRQ pulse width
Port rise and fall time (load = 50 pF)
override reset requests from internal sources.
1. Data in typical column was characterized at 3.0 V, 25°C or is typical recommended value.
2. See crystal or resonator manufacturer’s recommendation.
Frequency
Load Capacitors
Feedback resistor
Oscillator Characteristics
AC Characteristics
Table A-8. OSC Electrical Specifications (Temperature Range = -40 to 85°C Ambient)
Control Timing
(2)
(3)
cyc
= 1/f
Bus
Parameter
(1)
Characteristic
)
(4)
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
C
1
EXTAL
Table A-9. Control Timing
Crystal or Resonator
OSC
R
F
t
Symbol
Rise
t
t
t
MSSU
t
rstdrv
t
f
extrst
t
MSH
ILIH
Bus
RTI
Symbol
, t
f
Fall
OSC
C
C
R
1
2
F
XTAL
1.5 t
1.5 t
34 t
Min
400
dc
25
25
Min
C
cyc
cyc
cyc
1
2
Typical
Typ
1
3
Note
(1)
Freescale Semiconductor
(2)
Max
16
1600
Max
8
Unit
MHz
MΩ
MHz
Unit
µs
ns
ns
ns
ns
ns
ns

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