71M6532D-IGTR/F Maxim Integrated Products, 71M6532D-IGTR/F Datasheet - Page 5
![no-image](/images/manufacturer_photos/0/4/417/maxim_integrated_products_sml.jpg)
71M6532D-IGTR/F
Manufacturer Part Number
71M6532D-IGTR/F
Description
IC ENERGY METER 128KB 100-LQFP
Manufacturer
Maxim Integrated Products
Datasheet
1.71M6531D-IMRF.pdf
(120 pages)
Specifications of 71M6532D-IGTR/F
Mounting Style
SMD/SMT
Package / Case
LQFP-100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
71M6532D-IGTR/F
Manufacturer:
Maxim Integrated
Quantity:
10 000
FDS 6531/6532 005
Data Sheet 71M6531D/F-71M6532D/F
Figures
Figure 1: 71M6531D/F IC Functional Block Diagram ................................................................................... 8
Figure 2: 71M6532D/F IC Functional Block Diagram ................................................................................... 9
Figure 3: General Topology of a Chopped Amplifier .................................................................................. 13
Figure 4: CROSS Signal with CHOP_E[1:0] = 00 ....................................................................................... 13
Figure 5: AFE Block Diagram (Shown for the 71M6532D/F) ...................................................................... 14
Figure 6: Samples from Multiplexer Cycle .................................................................................................. 18
Figure 7: Accumulation Interval .................................................................................................................. 18
Figure 8: Interrupt Structure ........................................................................................................................ 35
Figure 9: Optical Interface ........................................................................................................................... 41
Figure 10: Connecting an External Load to DIO Pins ................................................................................. 45
Figure 11: 3-Wire Interface. Write Command, HiZ=0 ................................................................................ 48
Figure 12: 3-Wire Interface. Write Command, HiZ=1 ................................................................................ 48
Figure 13: 3-Wire Interface. Read Command. ........................................................................................... 49
Figure 14: 3-Wire Interface. Write Command when CNT=0 ...................................................................... 49
Figure 15: 3-Wire Interface. Write Command when HiZ=1 and WFR=1 ................................................... 49
Figure 16: SPI Slave Port: Typical Read and Write operations .................................................................. 51
Figure 17: Functions defined by V1 ............................................................................................................ 52
Figure 18: Voltage, Current, Momentary and Accumulated Energy ........................................................... 54
Figure 19: Timing Relationship between ADC MUX, Compute Engine ...................................................... 55
Figure 20: RTM Output Format ................................................................................................................... 55
Figure 21: Operation Modes State Diagram ............................................................................................... 56
Figure 22: Transition from BROWNOUT to MISSION Mode when System Power Returns ...................... 59
Figure 23: Power-Up Timing with V3P3SYS and VBAT tied together ........................................................ 59
Figure 24: Power-Up Timing with VBAT only .............................................................................................. 60
Figure 25: Wake Up Timing ........................................................................................................................ 61
Figure 26: MPU/CE Data Flow .................................................................................................................... 62
Figure 27: MPU/CE Communication ........................................................................................................... 62
Figure 28: Resistive Voltage Divider ........................................................................................................... 63
Figure 29: CT with Single Ended (Left) and Differential Input (Right) Connection ..................................... 63
Figure 30: Resistive Shunt (Left) and Rogowski Sensor (Right) Connection ............................................. 63
Figure 31: Connecting LCDs ....................................................................................................................... 66
2
Figure 32: I
C EEPROM Connection .......................................................................................................... 66
Figure 33: Three-Wire EEPROM Connection ............................................................................................. 67
Figure 34: Connections for UART0 ............................................................................................................. 67
Figure 35: Connection for Optical Components .......................................................................................... 68
Figure 36: Voltage Divider for V1 ................................................................................................................ 68
Figure 37: External Components for the RESET Pin: Push-button (Left), Production Circuit (Right) ........ 69
Figure 38: External Components for the Emulator Interface ...................................................................... 69
Figure 39: Connecting a Battery ................................................................................................................. 70
Figure 40: CE Data Flow: Multiplexer and ADC.......................................................................................... 96
Figure 41: CE Data Flow: Scaling, Gain Control, Intermediate Variables .................................................. 96
Figure 42: CE Data Flow: Squaring and Summation Stages ...................................................................... 97
Figure 43: SPI Slave Port (MISSION Mode) Timing ................................................................................. 106
Figure 44: Wh Accuracy, 0.1 A to 200 A at 240 V/50 Hz and Room Temperature .................................. 107
Figure 45: QFN-68 Package Outline, Top and Side View ........................................................................ 108
Figure 46: QFN-68 Package Outline, Bottom View .................................................................................. 108
Figure 47: Pinout for QFN-68 Package ..................................................................................................... 109
Figure 48: PCB Land Pattern for QFN 68 Package .................................................................................. 110
Figure 49: PCB Land Pattern for LQFP-100 Package .............................................................................. 111
Figure 50: LQFP-100 Package, Mechanical Drawing ............................................................................... 112
Figure 51: I/O Equivalent Circuits ............................................................................................................. 115
v1.3
© 2005-2010 TERIDIAN Semiconductor Corporation
5