71M6532D-IGTR/F Maxim Integrated Products, 71M6532D-IGTR/F Datasheet - Page 77
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71M6532D-IGTR/F
Manufacturer Part Number
71M6532D-IGTR/F
Description
IC ENERGY METER 128KB 100-LQFP
Manufacturer
Maxim Integrated Products
Datasheet
1.71M6531D-IMRF.pdf
(120 pages)
Specifications of 71M6532D-IGTR/F
Mounting Style
SMD/SMT
Package / Case
LQFP-100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
71M6532D-IGTR/F
Manufacturer:
Maxim Integrated
Quantity:
10 000
FDS 6531/6532 005
4.2
The following conventions apply to the descriptions in this table:
•
•
•
•
v1.3
ADC_E
BME
BOOT_SIZE[7:0] 20A7[7:0]
CE10MHZ
CE_E
CE_LCTN[7:0]
CHOP_E[1:0]
CHOP_IA
CHOP_IB
CHOP_I_E
CKOUT_E
Bits with a W (write) direction are written by the MPU into configuration RAM. Typically, they are initially stored in flash memory and copied to
the configuration RAM by the MPU. Some of the more frequently programmed bits are mapped to the MPU SFR memory space. The remaining
bits are mapped to 2xxx.
Bits with a R (read) direction can be read by the MPU.
Columns labeled Reset and Wake describe the bit values upon reset and wake, respectively. “NV” in the Wake column means the bit is powered
by the nonvolatile supply and is not initialized. LCD-related registers labeled “L” retain data upon transition from LCD mode to BROWNOUT
mode and vice versa, but do not retain data in SLEEP mode. “–“ means that the value is undefined.
Write-only bits will return zero when they are read.
Name
I/O RAM Description – Alphabetical Order
2005[3]
2020[6]
2000[3]
2000[4]
20A8[4:0]
2002[5:4]
20AC[0]
20AC[4]
20AB[0]
2004[4]
Location
Reset
01
31
0
0
0
0
0
0
0
0
0
Wake
01
31
0
–
0
0
0
0
0
0
0
© 2005-2010 TERIDIAN Semiconductor Corporation
Table 55: I/O RAM Description - Alphabetical
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Dir
must be set also.
Enables ADC and VREF. When disabled, removes bias current.
Battery Measure Enable. When set, a load current is immediately applied to the battery
and it is connected to the ADC to be measured on Alternative Mux Cycles. See the
MUX_ALT bit.
End of space reserved for boot program. The ending address of the boot region is
1024*BOOT_SIZE.
CE clock select. When set, the CE is clocked at 10 MHz. Otherwise, the CE clock
frequency is 5 MHz.
CE enable.
CE program location. The starting address for the CE program is 1024*CE_LCTN.
Chop enable for the reference bandgap circuit. The value of CHOP will change on the
rising edge of MUXSYNC according to the value in CHOP_E[1:0]:
This bit enables chop mode for the IA current channel (71M6532D/F only). CHOP_I_E
must be set also.
This bit enables chop mode for the IB current channel (71M6532D/F only). CHOP_I_E
This bit must be set to enable chop mode for the current channels (71M6532D/F only).
Control bit for the SEG19/CKOUT pin:
0: The pin is the SEG19 LCD driver
1: The pin is the CK_FIR output (5 MHz in mission mode, 32 kHz in brownout mode)
00 = toggle, except at the mux sync edge at the end of SUMCYCLE, an alternative
MUX frame is automatically inserted at the end of each accumulation interval.
01 = positive.
10 = reversed.
11 = toggle, no alternative MUX frame is inserted
Description
Data Sheet 71M6531D/F-71M6532D/F
77