AT86RF231-ZU Atmel, AT86RF231-ZU Datasheet - Page 117
![IC TXRX ZIGBE/802.15.4/ISM 32QFN](/photos/14/21/142149/mfg_at86rf231-zu_sml.jpg)
AT86RF231-ZU
Manufacturer Part Number
AT86RF231-ZU
Description
IC TXRX ZIGBE/802.15.4/ISM 32QFN
Manufacturer
Atmel
Datasheet
1.AT86RF231-ZUR.pdf
(198 pages)
Specifications of AT86RF231-ZU
Frequency
2.4GHz
Data Rate - Maximum
2Mbps
Modulation Or Protocol
802.15.4 Zigbee, 6LoWPAN, RF4CE, SP100, WirelessHART™, ISM
Applications
Industrial Monitoring and Control, Wireless Alarm and Security Systems
Power - Output
-17dBm ~ 3dBm
Sensitivity
-101dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
12.3mA
Current - Transmitting
14mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
2405 MHz to 2480 MHz
Interface Type
SPI
Noise Figure
6 dB
Output Power
20 dB
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
12.3 mA
Minimum Operating Temperature
- 40 C
Modulation
OQPSK
Protocol Supported
802.15.4
Transmitting Current
11.6mA
Data Rate
2Mbps
Frequency Range
2.405GHz To 2.48GHz
Modulation Type
O-QPSK
Sensitivity Dbm
-101dBm
Rf Ic Case Style
QFN
No. Of Pins
32
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT86RF231-ZU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
9.6.3
9.6.4
8111C–MCU Wireless–09/09
External Reference Frequency Setup
Master Clock Signal Output (CLKM)
To calculate the total load capacitance, the following formula can be used:
C
The trimming capacitors provide the possibility of reducing frequency deviations caused by pro-
duction process variations or by external components tolerances. Note that the oscillation
frequency can only be reduced by increasing the trimming capacitance. The frequency deviation
caused by one step of C
An amplitude control circuit is included to ensure stable operation under different operating con-
ditions and for different crystal types. Enabling the crystal oscillator in P_ON state and after
leaving SLEEP state causes a slightly higher current during the amplitude build-up phase to
guarantee a short start-up time. At stable operation, the current is reduced to the amount neces-
sary for a robust operation. This also keeps the drive level of the crystal low.
Generally, crystals with a higher load capacitance are less sensitive to parasitic pulling effects
caused by external component variations or by variations of board and circuit parasitics. On the
other hand, a larger crystal load capacitance results in a longer start-up time and a higher steady
state current consumption.
When using an external reference frequency, the signal must be connected to pin 26 (XTAL1) as
indicated in
XOSC_CTRL) need to be set to the external oscillator mode. The oscillation peak-to-peak ampli-
tude shall be between 100 mV and 500 mV, the optimum range is between 400 mV and 500 mV.
Pin 25 (XTAL2) should not be wired.
Figure 9-8.
The generated reference clock signal can be fed to a microcontroller using pin 17 (CLKM). The
internal 16 MHz raw clock can be divided by an internal prescaler. Thus, clock frequencies of
16 MHz, 8 MHz, 4 MHz, 2 MHz, 1 MHz, 250 kHz, or 62.5 kHz can be supplied by pin CLKM.
The CLKM frequency, update scheme, and pin driver strength is configurable using register
0x03 (TRX_CTRL_0). There are two possibilities how a CLKM frequency change gets effective.
If CLKM_SHA_SEL = 0 and/or CLKM_CTRL = 0, changing the register bits CLKM_CTRL imme-
diately affects the CLKM clock rate. Otherwise (CLKM_SHA_SEL = 1 and CLKM_CTRL > 0
before changing the register bits CLKM_CTRL) the new clock rate is supplied when leaving the
SLEEP state the next time.
To reduce power consumption and spurious emissions, it is recommended to turn off the CLKM
clock when not in use or to reduce its driver strength to a minimum, refer to
Pins” on page
L
= 0.5 * (CX + C
Figure 9-8 on page 117
7.
Setup for Using an External Frequency Reference
TRIM
+ C
TRIM
PAR
decreases with increasing crystal load capacitor values.
).
XTAL1
and the register bits XTAL_MODE (register 0x12,
16 MHz
XTAL2
AT86RF231
PCB
AT86RF231
Section 1.3 “Digital
117