MC13212 Freescale Semiconductor, MC13212 Datasheet - Page 64
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MC13212
Manufacturer Part Number
MC13212
Description
IC TXRX RF 2.4GHZ FLSH 32K 71LGA
Manufacturer
Freescale Semiconductor
Series
MC1321xr
Datasheet
1.1321XCSK-BDM.pdf
(70 pages)
Specifications of MC13212
Frequency
2.4GHz
Data Rate - Maximum
250kbps
Modulation Or Protocol
802.15.4 Zigbee
Applications
General Purpose
Power - Output
3dBm
Sensitivity
-92dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
42mA
Current - Transmitting
35mA
Data Interface
PCB, Surface Mount
Memory Size
32kB Flash, 2kB RAM
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
71-LGA
Mounting Style
SMD/SMT
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC13212
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MC13212R2
Manufacturer:
FREESCALE
Quantity:
340
Since the MC1321x contains an on-chip reference frequency trim capability, it is possible to trim out
virtually all of the initial tolerance factors and put the frequency within 0.12 ppm on a board-by-board
basis. Individual trimming of each board in a production environment allows use of the lowest cost crystal,
but requires that each board go through a trimming procedure. This step can be avoided by
using/specifying a crystal with a tighter stability tolerance, but the crystal will be slightly higher in cost.
A tolerance analysis budget may be created using all the previously stated factors. It is an engineering
judgment whether the worst case tolerance will assume that all factors will vary in the same direction or if
the various factors can be statistically rationalized using RSS (Root-Sum-Square) analysis. The aging
factor is usually specified in ppm/year and the product designer can determine how many years are to be
assumed for the product lifetime. Taking all of the factors into account, the product designer can determine
the needed specifications for the crystal and external load capacitors to meet the 802.15.4 Standard.
7.1.2
The suggested crystal specification for the MC1321x is shown in
parameters are related to desired package, desired temperature range and use of crystal capacitive load
trimming. For more design details and suggested crystals, see application note AN3251, Reference
Oscillator Crystal Requirements for MC1319x, MC1320x, and MC1321x.
64
Frequency
Frequency tolerance (cut tolerance)
Frequency stability (temperature drift)
Aging
Equivalent series resistance
Load capacitance
Crystal Requirements
4
Parameter
6
Y1 = Daishinku KDS - DSX321G ZD00882
Figure 34. MC1321x Modem Crystal Circuit
5
Table 22. MC1321x Crystal Specifications
MC13211/212/213 Technical Data, Rev. 1.8
U3
MC1321x
XTAL1
XTAL2
2
3
16.000000
27
28
Value
5 - 9
± 10
± 15
± 2
43
Y1
16MHz
MHz
Unit
ppm
ppm
ppm
pF
Ω
at 25 °C
Over desired temperature range
max
max
Table
C10
6.8pF
C11
6.8pF
22. A number of the stated
1
Condition
Freescale Semiconductor