SL3S1002FTB1,115 NXP Semiconductors, SL3S1002FTB1,115 Datasheet - Page 20

• Manufacturer Part Number: SL3S1002FTB1,115
• Description: IC UCODE G2XM FTB1 SOT1122
• Manufacturer: NXP Semiconductors

Specifications of SL3S1002FTB1,115

• Rf Type: Read / Write
• Frequency: 865MHz ~ 928MHz
• Features: ISO 18000-6C
• Package / Case: 3-XSON, SOT1122
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935290254115

NXP Semiconductors
14. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
15. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
157335
Product short data sheet
CONFIDENTIAL
Block diagram of G2X IC . . . . . . . . . . . . . . . . . . . .5
Wafer layout and pinning information . . . . . . . . . .6
Pinning - SOT1040-1 . . . . . . . . . . . . . . . . . . . . . . .7
Package TSSOP8, SOT505-1 . . . . . . . . . . . . . . . .8
Package outline SOT1122 . . . . . . . . . . . . . . . . . . .9
Package FCS2, SOT1040AA1, 12 μm Cu
metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package FCS2, SOT1040AB2, 20 μm Al
metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Splicing drawing SOT1040-1 . . . . . . . . . . . . . . . .13
G2X TID memory structure . . . . . . . . . . . . . . . . .16
Ordering information G2XM . . . . . . . . . . . . . . . .4
Ordering information G2XL. . . . . . . . . . . . . . . . .4
Pin description of SOT1040-1 . . . . . . . . . . . . . .7
Pin description of TSSOP8 . . . . . . . . . . . . . . . . .8
Pin description of SOT1122 . . . . . . . . . . . . . . .10
SOT1122 Marking. . . . . . . . . . . . . . . . . . . . . . .10
Rev. 3.5 — 2 November 2009
157335
Table 7.
Table 8.
Table 9.
Table 10. G2X memory sections . . . . . . . . . . . . . . . . . . . 16
Table 11. Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 12. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Limiting values
Package interface characteristics . . . . . . . . . . 15
Wafer characteristics . . . . . . . . . . . . . . . . . . . . 15
SL3ICS1002/1202
[1][2]
. . . . . . . . . . . . . . . . . . . . . . 14
UCODE G2XM and G2XL
© NXP B.V. 2009. All rights reserved.
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