SL3S1002FTB1,115 NXP Semiconductors, SL3S1002FTB1,115 Datasheet - Page 6

• Manufacturer Part Number: SL3S1002FTB1,115
• Description: IC UCODE G2XM FTB1 SOT1122
• Manufacturer: NXP Semiconductors

Specifications of SL3S1002FTB1,115

• Rf Type: Read / Write
• Frequency: 865MHz ~ 928MHz
• Features: ISO 18000-6C
• Package / Case: 3-XSON, SOT1122
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935290254115

NXP Semiconductors
6. Wafer layout and pinning information
157335
Product short data sheet
CONFIDENTIAL
6.1 Wafer layout
Fig 2.
(1) X-scribe line width: 56.4 μm
(2) Y-scribe line width: 56.4 μm
(3) Chip step, x-length: 488.0 μm
(4) Chip step, y-length: 470,0 μm
(5) Bump to bump distance X (TP1 - RFN): 351,0 μm
(6) Bump to bump distance Y (RFN - RFP): 333,0 μm
(7) Distance bump to metal sealring X: 40,3 μm
(8) Distance bump to metal sealring Y: 40,3 μm
Bump size X x Y: 60 μm x 60 μm
Wafer layout and pinning information
(1)
Rev. 3.5 — 2 November 2009
(7)
(2)
157335
TP2
TP1
Y
(8)
not to scale!
(5)
(3)
X
RFN
RFP
SL3ICS1002/1202
(6)
UCODE G2XM and G2XL
001aai346
(4)
© NXP B.V. 2009. All rights reserved.
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