IP4286CZ6-TBF,115 NXP Semiconductors, IP4286CZ6-TBF,115 Datasheet - Page 12

DIODE ESD PROT XSON6

IP4286CZ6-TBF,115

Manufacturer Part Number
IP4286CZ6-TBF,115
Description
DIODE ESD PROT XSON6
Manufacturer
NXP Semiconductors
Datasheet

Specifications of IP4286CZ6-TBF,115

Mounting Type
Surface Mount
Voltage - Reverse Standoff (typ)
5.5V
Polarization
4 Channel Array - Bidirectional
Package / Case
6-XFDFN
Channels
4 Channels
Breakdown Voltage
6 V to 9 V
Capacitance
20 pF
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Breakdown
-
Power (watts)
-
Lead Free Status / Rohs Status
 Details
Other names
568-5534-2
NXP Semiconductors
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
6.1
7
8
8.1
8.2
8.3
8.4
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Soldering of SMD packages . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Typical application. . . . . . . . . . . . . . . . . . . . . . . 3
Introduction to soldering . . . . . . . . . . . . . . . . . . 7
Wave and reflow soldering . . . . . . . . . . . . . . . . 7
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 7
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Integrated 4-channel ESD protection
IP4286CZ6
Document identifier: IP4286CZ6_1
Date of release: 20 April 2009
All rights reserved.

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