IP4286CZ6-TBF,115 NXP Semiconductors, IP4286CZ6-TBF,115 Datasheet - Page 9

DIODE ESD PROT XSON6

IP4286CZ6-TBF,115

Manufacturer Part Number
IP4286CZ6-TBF,115
Description
DIODE ESD PROT XSON6
Manufacturer
NXP Semiconductors
Datasheet

Specifications of IP4286CZ6-TBF,115

Mounting Type
Surface Mount
Voltage - Reverse Standoff (typ)
5.5V
Polarization
4 Channel Array - Bidirectional
Package / Case
6-XFDFN
Channels
4 Channels
Breakdown Voltage
6 V to 9 V
Capacitance
20 pF
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Breakdown
-
Power (watts)
-
Lead Free Status / Rohs Status
 Details
Other names
568-5534-2
NXP Semiconductors
9. Abbreviations
IP4286CZ6_1
Objective data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 7.
Acronym
DVI
ESD
HDMI
LAN
PCS
PDA
RoHS
USB
WAN
Fig 5.
temperature
MSL: Moisture Sensitivity Level
Temperature profiles for large and small components
Abbreviations
Description
Digital Visual Interface
ElectroStatic Discharge
High-Definition Multimedia Interface
Local Area Network
Personal Communications Services
Personal Digital Assistant
Restriction of Hazardous Substances
Universal Serial Bus
Wide Area Network
Rev. 01 — 20 April 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Integrated 4-channel ESD protection
temperature
peak
IP4286CZ6
© NXP B.V. 2009. All rights reserved.
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