PCA9601D,118 NXP Semiconductors, PCA9601D,118 Datasheet - Page 28
![IC DUAL BI-DIR BUS BUFFER 8-SOIC](/photos/39/71/397193/inhouse_ca9601d118_t_sml.jpg)
PCA9601D,118
Manufacturer Part Number
PCA9601D,118
Description
IC DUAL BI-DIR BUS BUFFER 8-SOIC
Manufacturer
NXP Semiconductors
Datasheet
1.PCA9601D118.pdf
(31 pages)
Specifications of PCA9601D,118
Number Of Channels Per Chip
2
Supply Voltage (max)
15 V
Supply Voltage (min)
2.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
SO-8
Interface
I2C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5303-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCA9601D,118
Manufacturer:
NXP
Quantity:
5 600
NXP Semiconductors
13. Abbreviations
14. Revision history
Table 11.
PCA9601_1
Product data sheet
Document ID
PCA9601_1
Revision history
Release date
20100528
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 10.
Acronym
CDM
ESD
HBM
I
I/O
IC
MM
PMBus
SCL
SDA
SMBus
TTL
2
Fig 29. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Data sheet status
Product data sheet
All information provided in this document is subject to legal disclaimers.
Description
Charged-Device Model
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Input/Output
Integrated Circuit
Machine Model
Power Management Bus
Serial Clock Line
Serial DAta line
System Management Bus
Transistor-Transistor Logic
Rev. 01 — 28 May 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
Dual bidirectional bus buffer
temperature
Supersedes
-
peak
PCA9601
© NXP B.V. 2010. All rights reserved.
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