LPC1226FBD64/301 NXP Semiconductors, LPC1226FBD64/301 Datasheet - Page 37

• Manufacturer Part Number: LPC1226FBD64/301
• Description: MCU, 96K FLASH, CORTEX-M0, 64LQFP
• Manufacturer: NXP Semiconductors

Specifications of LPC1226FBD64/301

• Rohs Compliant: YES
• Featured Product: LPC122x Cortex-M0 Microcontrollers
• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 45MHz
• Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number Of I /o: 55
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Controller Family/series: LPC1200
• No. Of I/o's: 55
• Ram Memory Size: 8KB
• Cpu Speed: 30MHz
• No. Of Timers: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-5162; LPC1226FBD64/301

NXP Semiconductors
LPC122X
Objective data sheet
Fig 10. Deep-sleep mode: Typical supply current I
Fig 11. Deep power-down mode: Typical supply current I
(μA)
I
DD
35
30
25
20
15
Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register
(PDSLEEPCFG =<tbd>).
supply voltages V
different supply voltages V
−40
V
DD(3V3)
All information provided in this document is subject to legal disclaimers.
= 3.6 V
(X)
3.3 V
3.0 V
X
Rev. 1.2 — 29 March 2011
−15
X
X
X
X
X
X
X
DD(3V3)
X
<tbd>
DD(3V3)
10
X
X
32-bit ARM Cortex-M0 microcontroller
35
DD
versus temperature for different
X
001aab173
DD
X (X)
versus temperature for
X
60
temperature (°C)
LPC122x
002aag021
© NXP B.V. 2011. All rights reserved.
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