HY27UF084G2B-TPCB HYNIX SEMICONDUCTOR, HY27UF084G2B-TPCB Datasheet - Page 42

IC, MEMORY, FLASH NAND 4GB, TSOP48

HY27UF084G2B-TPCB

Manufacturer Part Number
HY27UF084G2B-TPCB
Description
IC, MEMORY, FLASH NAND 4GB, TSOP48
Manufacturer
HYNIX SEMICONDUCTOR
Datasheet

Specifications of HY27UF084G2B-TPCB

Access Time
20ns
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
0°C To +70°C
Package / Case
TSOP
Base Number
27
Interface
Parallel
Logic
RoHS Compliant
Memory Type
Flash - NAND
Memory Configuration
512M X 8
Rohs Compliant
Yes

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HY27UF084G2B-TPCB
Manufacturer:
HYNIX
Quantity:
11 250
Part Number:
HY27UF084G2B-TPCB
Manufacturer:
HYNIX
Quantity:
12 500
Part Number:
HY27UF084G2B-TPCB
Manufacturer:
HYNIX/海力士
Quantity:
20 000
1
HY27UF(08/16)4G2B Series
4Gbit (512Mx8bit) NAND Flash
System Interface Using CE don’t care
To simplify system interface, CE may be deasserted during data loading or sequential data-reading as shown below.
So, it is possible to connect NAND Flash to a microporcessor. The only function that was removed from standard NAND
Flash to make CE don’t care read operation was disabling of the automatic sequential read function.
Figure 23: Program Operation with CE don’t-care.
Figure 24: Read Operation with CE don’t-care.
Rev 0.4 / Jan. 2008
42

Related parts for HY27UF084G2B-TPCB