S29AL004D70TFI010 Spansion Inc., S29AL004D70TFI010 Datasheet - Page 12

• Manufacturer Part Number: S29AL004D70TFI010
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL004D70TFI010

• Memory Size: 4Mbit
• Memory Configuration: 512K X 8 / 256K X 16
• Ic Interface Type: Parallel
• Access Time: 70ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
Notes:
1.
2.
3.
10
S29AL004D
Device Number
Type 0 is standard. Specify other options as required: TSOPs and SOs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2,
or 3.
TSOP package marking omits packing type designator from ordering part number.
BGA package marking omits leading S29 and packing type designator from ordering part number.
S29AL004D
Standard Products
Spansion standard products are available in several packages and operating
ranges. The order number (Valid Combination) is formed by a combination of the
elements below.
Valid Combinations list configurations planned to be supported in volume for this device.
Consult your local sales office to confirm availability of specific valid combinations and to
check on newly released combinations.
70
DEVICE NUMBER/DESCRIPTION
S29AL004D
4 Megabit Flash Memory manufactured using 200 nm process technology
3.0 Volt-only Read, Program, and Erase
Option
Speed
70, 90
T
S29AL004D Valid Combinations
A
I
Temperature Range
Package Type,
Material, and
01
MAI, MFI
BAI, BFI
TAI, TFI
0
A d v a n c e
Valid Combinations
PACKING TYPE
0
2
3
MODEL NUMBER
01
02
TEMPERATURE RANGE
I
PACKAGE MATERIAL SET
A
F
PACKAGE TYPE
T
B
M
SPEED OPTION
70
90
S29AL004D
= Tray
= 7” Tape and Reel
= 13” Tape and Reel
= V
= V
= Industrial (–40
= Standard
= Pb-Free
= Thin Small Outline Package (TSOP) Standard Pinout
= Fine-pitch Ball-Grid Array Package
= Small Outline package (SO)
= 70 ns Access Speed
= 90 ns Access Speed
Number
Model
01, 02
CC
CC
= 2.7 - 3.6V, top boot sector device
= 2.7 - 3.6V, bottom boot sector device
I n f o r m a t i o n
0, 2, 3 (Note 1)
Packing Type
°
C to +85
°
C)
VBK048 (Note 3)
TS048 (Note 2)
SO044
Package Description
S29AL004D_00_A1 February 18, 2005
Fine-Pitch BGA
TSOP
SOP