S29AL004D70TFI010 Spansion Inc., S29AL004D70TFI010 Datasheet - Page 53

• Manufacturer Part Number: S29AL004D70TFI010
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL004D70TFI010

• Memory Size: 4Mbit
• Memory Configuration: 512K X 8 / 256K X 16
• Ic Interface Type: Parallel
• Access Time: 70ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Physical Dimensions
February 18, 2005 S29AL004D_00_A1
CORNER
PACKAGE
JEDEC
SYMBOL
A
SD / SE
PIN A1
MD
A1
A2
D1
ME
E1
fb
D
N
A
E
e
A1
VBK 048 - 48 Ball Fine-Pitch Ball Grid Array (FBGA) 8.15 x 6.15 mm
8.15 mm x 6.15 mm NOM
0.18
0.62
0.35
MIN
---
INDEX MARK
10
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
PACKAGE
VBK 048
NOM
N/A
---
---
---
---
---
48
8
6
SEATING PLANE
TOP VIEW
SIDE VIEW
A d v a n c e
MAX
1.00
0.76
0.43
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
I n f o r m a t i o n
A
0.10
A2
S29AL004D
C
(4X)
E
B
e
0.08
0.10
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4. e
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
C
6
C
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIAMETER IN A PLANE PARALLEL TO DATUM C.
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
f 0.08
f 0.15
fb
REPRESENTS THE SOLDER BALL GRID PITCH.
H
M
M
C
C
G
A
BOTTOM VIEW
B
F
E
D1
D
SD
C
7
B
A
6
5
4
3
2
1
3338 \ 16-038.25b
A1 CORNER
SE
7
E1
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