S29AL004D70TFI010 Spansion Inc., S29AL004D70TFI010 Datasheet - Page 51

• Manufacturer Part Number: S29AL004D70TFI010
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of S29AL004D70TFI010

• Memory Size: 4Mbit
• Memory Configuration: 512K X 8 / 256K X 16
• Ic Interface Type: Parallel
• Access Time: 70ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2. Under worst case conditions of 90°C, V
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program
6. The device has a minimum erase and program cycle endurance of 100,000 cycles per sector
Notes:
1. Sampled, not 100% tested.
2. Test conditions T
February 18, 2005 S29AL004D_00_A1
bytes program faster than the maximum program times listed.
command. See
Parameter
Symbol
C
C
C
OUT
IN2
IN
Table on page 24
A
= 25°C, f = 1.0 MHz.
Parameter Description
Control Pin Capacitance
A d v a n c e
Output Capacitance
Input Capacitance
Table 16. TSOP, SO, And BGA Pin Capacitance
for further information on command definitions.
CC
= 2.7 V, 1,000,000 cycles.
I n f o r m a t i o n
S29AL004D
Test Setup
V
V
V
OUT
IN
IN
= 0
= 0
= 0
Package
TSOP, SO
TSOP, SO
TSOP, SO
BGA
BGA
BGA
Typ
4.2
8.5
5.4
7.5
3.9
6
Max
7.5
5.0
6.5
4.7
12
9
Unit
pF
49