CRS08 Toshiba, CRS08 Datasheet
CRS08
Specifications of CRS08
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CRS08 Summary of contents
Page 1
... Device mounted on a ceramic board (soldering land (j-a) Device mounted on a glass-epoxy board (soldering land (j-ℓ JEDEC ― JEITA ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) Min Typ. Max 0.23 0.32 0.345 0. mm) 140 6 mm) 20 2005-11-22 CRS08 Unit: mm Unit °C/W °C/W ...
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... Please refer to the Rectifiers databook for further information. Unit: mm higher I ; therefore, thermal runaway might occur when F RRM RRM curve. F(AV) of below 100° has a temperature coefficient of 0.1%/°C. Take 2005-11-22 CRS08 F(AV) ...
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... Soldering land ② Device mounted on a glass-epoxy board Soldering land 1000 100 10 1 2.0 2 (typ.) 1 MHz 25° 100 1 3 CRS08 P – (AV) F (AV) DC 180° 120° 60° Rectangular waveform 0° 360° Conduction angle 0.8 1.2 1.6 2.0 2.4 r – (j- ② ...
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... Junction temperature T j (°C) (typ.) 4.8 Rectangular waveform 4.0 0° 3.2 Conduction angle T j 125° 2.4 1.6 0.8 0 120 140 CRS08 P – V (typ.) R (AV) R 360° DC 300° 240° 180° 120° 60° Reverse voltage V R (V) 2005-11-22 ...
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... Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 5 CRS08 030619EAA 2005-11-22 ...