EVAL-AD7986EBZ Analog Devices Inc, EVAL-AD7986EBZ Datasheet - Page 8

• Manufacturer Part Number: EVAL-AD7986EBZ
• Description: 18-Bit A/D Converter Eval. Board
• Manufacturer: Analog Devices Inc
• Series: PulSAR®r

Specifications of EVAL-AD7986EBZ

• Silicon Manufacturer: Analog Devices
• Application Sub Type: ADC
• Kit Application Type: Data Converter
• Silicon Core Number: AD7986
• Kit Contents: Board
• Number Of Adc's: 1
• Number Of Bits: 18
• Sampling Rate (per Second): 2M
• Data Interface: Serial
• Inputs Per Adc: 1 Differential
• Input Range: ±VREF
• Power (typ) @ Conditions: 29mW @ 2MSPS
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD7986
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD7986
Pin No.
16
17,18
19
20
21 (EPAD)
1
AI = analog input, AI/O = bidirectional analog; DI = digital input, DO = digital output, and P = power.
Mnemonic
AVDD
AGND
BVDD
REFIN
Exposed Pad
Type
P
P
P
AI/O
EP
1
Description
Input Analog Power. Nominally at 2.5 V.
Analog Power Ground.
Reference buffer power. Nominally 5.0 V.
If an external reference buffer is used to achieve the maximum SNR performance with 5 V reference,
the reference buffer must be powered down by connecting the REFIN pin to ground. The external
reference buffer must be connected to the BVDD pin.
Internal Reference Output/Reference Buffer Input.
When PDREF = low, the internal band gap reference produces a 1.2 V (typical) voltage on this pin,
which needs external decoupling (0.1 µF typical).
When PDREF = high, use an external reference to provide a 1.2 V (typical) to this pin.
When PDREF = high, and REFIN = low, the on-chip reference buffer and band gap are powered down.
An external reference must be connected to REF and BVDD.
The exposed pad is not connected internally. For increased reliability of the solder joints, it is
recommended that the pad be soldered to the system ground plane.
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