CY7C1480V33-167AXC Cypress Semiconductor Corp, CY7C1480V33-167AXC Datasheet - Page 21

• Manufacturer Part Number: CY7C1480V33-167AXC
• Description: CY7C1480V33-167AXC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1480V33-167AXC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 72M (2M x 36)
• Speed: 167MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Density: 72Mb
• Access Time (max): 3.4ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 167MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 21b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 4
• Supply Current: 450mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 2M
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-2169; CY7C1480V33-167AXC

Document Number: 38-05283 Rev. *J
Switching Characteristics
Notes
t
Clock
t
t
t
Output Times
t
t
t
t
t
t
t
Setup Times
t
t
t
t
t
t
Hold Times
t
t
t
t
t
t
15. This part has an internal voltage regulator; t
16. t
17. At any possible voltage and temperature, t
18. This parameter is sampled and not 100% tested.
19. Timing reference level is 1.5V when V
20. Test conditions shown in (a) of
POWER
CYC
CH
CL
CO
DOH
CLZ
CHZ
OEV
OELZ
OEHZ
AS
ADS
ADVS
WES
DS
CES
AH
ADH
ADVH
WEH
DH
CEH
Parameter
can be initiated.
±200 mV from steady-state voltage.
data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed
to achieve High-Z before Low-Z under the same system conditions.
CHZ
, t
CLZ
,t
OELZ
, and t
V
Clock Cycle Time
Clock HIGH
Clock LOW
Data Output Valid After CLK Rise
Data Output Hold After CLK Rise
Clock to Low-Z
Clock to High-Z
OE LOW to Output Valid
OE LOW to Output Low-Z
OE HIGH to Output High-Z
Address Setup Before CLK Rise
ADSC, ADSP Setup Before CLK Rise
ADV Setup Before CLK Rise
GW, BWE, BW
Data Input Setup Before CLK Rise
Chip Enable Setup Before CLK Rise
Address Hold After CLK Rise
ADSP, ADSC Hold After CLK Rise
ADV Hold After CLK Rise
GW, BWE, BW
Data Input Hold After CLK Rise
Chip Enable Hold After CLK Rise
OEHZ
DD
(Typical) to the First Access
are specified with AC test conditions shown in part (b) of
AC Test Loads and Waveforms
DDQ
Over the Operating Range
[16, 17, 18]
X
X
OEHZ
[16, 17, 18]
= 3.3V and is 1.25V when V
POWER
Hold After CLK Rise
Setup Before CLK Rise
Description
is less than t
is the time that the power needs to be supplied above V
[16, 17, 18]
[16, 17, 18]
OELZ
[15]
unless otherwise noted.
and t
CHZ
DDQ
is less than t
[19, 20]
= 2.5V.
“AC Test Loads and Waveforms” on page
Min.
4.0
2.0
2.0
1.3
1.3
1.4
1.4
1.4
1.4
1.4
1.4
0.4
0.4
0.4
0.4
0.4
0.4
CLZ
1
0
250 MHz
to eliminate bus contention between SRAMs when sharing the same
Max.
3.0
3.0
3.0
3.0
DD
Min.
5.0
2.0
2.0
1.3
1.4
1.4
1.4
1.4
1.4
0.4
0.4
0.4
0.4
0.4
0.4
1.3
1.4
(minimum) initially before a read or write operation
1
0
200 MHz
Max.
3.0
3.0
3.0
3.0
CY7C1480V33
CY7C1482V33
CY7C1486V33
20. Transition is measured
Min.
6.0
2.4
2.4
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
0.5
0.5
0.5
0.5
0.5
0.5
1
0
167 MHz
Max.
3.4
3.4
3.4
3.4
Page 21 of 31
Unit
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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