BLF4G10-160 NXP Semiconductors, BLF4G10-160 Datasheet - Page 8

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BLF4G10-160

Manufacturer Part Number
BLF4G10-160
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF4G10-160

Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.065 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
15 V
Continuous Drain Current
15 A
Maximum Operating Temperature
+ 200 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
LDMOST-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF4G10-160,112
NXP Semiconductors
BLF4G10-160_1
Product data sheet
Table 8.
[1]
[2]
Component
C1, C4, C6, C7
C2
C3
C5, C9
C8
C10
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
R1
American Technical Ceramics type 100B or capacitor of same quality.
The striplines are on a double copper-clad Rogers 6006 Printed-Circuit Board (PCB) with
thickness = 0.635 mm.
List of components (see
Description
multilayer ceramic chip
capacitor
multilayer ceramic chip
capacitor
multilayer ceramic chip
capacitor
tantalum capacitor
ceramic capacitor
electrolytic capacitor
stripline
stripline
tapered stripline
stripline
stripline
stripline
stripline
tapered stripline
stripline
stripline
SMD resistor
Rev. 01 — 22 June 2007
Figure 12
Value
68 pF
1.5 pF
1.4 pF
10 F
1 F
220 F
-
-
-
-
-
-
-
-
-
-
5.1
and
Figure
[1]
[1]
[1]
[2]
[2]
[2]
[2]
[2]
[2]
[2]
[2]
[2]
[2]
Remarks
1812X7R105KL2AB
(W
(W
(W1
0.914 mm
(W
(W
(W
(W
(W1
17.221 mm
(W
(W
13).
UHF power LDMOS transistor
L) 0.914 mm
L) 0.914 mm
L) 19.812 mm
L) 0.914 mm
L) 1.524 mm
L) 17.221 mm
L) 0.914 mm
L) 0.914 mm
W2
W2
BLF4G10-160
L)
19.812 mm
L)
0.914 mm
© NXP B.V. 2007. All rights reserved.
10.160 mm
24.384 mm
42.342 mm
42.418 mm
19.126 mm
6.858 mm
21.438 mm
22.479 mm
r
11.024 mm
20.625 mm
= 6.15 and
8 of 14

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