BAW56W,115 NXP Semiconductors, BAW56W,115 Datasheet - Page 11
![DIODE SW DBL 90V 150MA SOT-323](/photos/5/24/52427/568-umt3_sot-323_sc-70_sot323_sml.jpg)
BAW56W,115
Manufacturer Part Number
BAW56W,115
Description
DIODE SW DBL 90V 150MA SOT-323
Manufacturer
NXP Semiconductors
Datasheet
1.BAW56S115.pdf
(15 pages)
Specifications of BAW56W,115
Package / Case
SC-70-3, SOT-323-3
Mounting Type
Surface Mount
Speed
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)
4ns
Current - Reverse Leakage @ Vr
500nA @ 80V
Voltage - Forward (vf) (max) @ If
1V @ 50mA
Voltage - Dc Reverse (vr) (max)
90V
Current - Average Rectified (io) (per Diode)
150mA (DC)
Diode Configuration
1 Pair Common Anode
Product
Switching Diodes
Peak Reverse Voltage
90 V
Forward Continuous Current
0.15 A
Max Surge Current
4 A
Configuration
Dual Common Anode
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.5 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934026020115::BAW56W T/R::BAW56W T/R
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BAW56W,115
Manufacturer:
NXP Semiconductors
Quantity:
9 600
NXP Semiconductors
BAV756S_BAW56_SER_5
Product data sheet
Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88)
Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88)
Dimensions in mm
solder lands
solder resist
occupied area
Dimensions in mm
4.50
solder lands
solder resist
occupied area
solder paste
Rev. 05 — 26 November 2007
2.35
transport direction during soldering
0.50
(4 )
BAV756S; BAW56 series
0.50
(4 )
5.25
1.15
3.75
2.65
1.20
2.40
0.60
(2 )
High-speed switching diodes
0.40
(2 )
0.90 2.10
0.30
© NXP B.V. 2007. All rights reserved.
sot363
1.00
sot363
4.00
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