PMEG2005CT,215 NXP Semiconductors, PMEG2005CT,215 Datasheet - Page 10

• Manufacturer Part Number: PMEG2005CT,215
• Description: SCHOTTKY RECT 20V 500MA SOT-23
• Manufacturer: NXP Semiconductors

Specifications of PMEG2005CT,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Mounting Type: Surface Mount
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 22ns
• Current - Reverse Leakage @ Vr: 200µA @ 20V
• Voltage - Forward (vf) (max) @ If: 390mV @ 500mA
• Voltage - Dc Reverse (vr) (max): 20V
• Current - Average Rectified (io) (per Diode): 500mA
• Diode Configuration: 1 Pair Common Cathode
• Product: Schottky Rectifiers
• Peak Reverse Voltage: 20 V
• Forward Continuous Current: 0.5 A
• Max Surge Current: 10 A
• Configuration: Single Dual Anode
• Recovery Time: 22 ns
• Forward Voltage Drop: 360 mV
• Maximum Reverse Leakage Current: 30 uA
• Maximum Power Dissipation: 330 mW
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934061751215

NXP Semiconductors
11. Soldering
PMEG2005CT
Product data sheet
Fig 16. Reflow soldering footprint SOT23 (TO-236AB)
Fig 17. Wave soldering footprint SOT23 (TO-236AB)
4.6
3
1.7
2.6
(3×)
0.7
(2×)
1.4
1.4
All information provided in this document is subject to legal disclaimers.
(2×)
1.2
Rev. 2 — 22 June 2010
(3×)
(3×)
3.3
2.9
1.9
0.5
0.6
1
2.2
2.8
4.5
500 mA low V
(3×)
0.6
F
dual MEGA Schottky barrier rectifier
2
preferred transport direction during soldering
PMEG2005CT
Dimensions in mm
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
occupied area
sot023_fr
sot023_fw
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