BAS21J,115 NXP Semiconductors, BAS21J,115 Datasheet - Page 7

DIODE HIGH SPEED SWITCHING SC-90

BAS21J,115

Manufacturer Part Number
BAS21J,115
Description
DIODE HIGH SPEED SWITCHING SC-90
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS21J,115

Package / Case
SC-90, SOD-323F
Mounting Type
Surface Mount
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
50ns
Current - Reverse Leakage @ Vr
150nA @ 250V
Voltage - Forward (vf) (max) @ If
1.1V @ 100mA
Voltage - Dc Reverse (vr) (max)
300V
Capacitance @ Vr, F
2pF @ 0V, 1MHz
Current - Average Rectified (io)
250mA (DC)
Product
Switching Diodes
Peak Reverse Voltage
300 V
Forward Continuous Current
250 mA
Max Surge Current
3 A
Configuration
Single
Recovery Time
50 ns
Forward Voltage Drop
1.1 V
Maximum Reverse Leakage Current
150 nA
Operating Temperature Range
+ 150 C
Maximum Diode Capacitance
2 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934060933115::BAS21J T/R::BAS21J T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS21J,115
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
9. Package outline
10. Packing information
11. Soldering
BAS21J_1
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
BAS21J
Fig 6. Package outline SOD323F (SC-90)
Fig 7. Reflow soldering footprint SOD323F (SC-90)
For further information and the availability of packing methods, see
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
Packing methods
0.95
Package
SOD323F
Dimensions in mm
0.50
(2 )
Rev. 01 — 8 March 2007
2.7
2.3
1.8
1.6
3.05
2.80
2.10
1.60
Description
4 mm pitch, 8 mm tape and reel
1.35
1.15
1
2
0.40
0.25
0.50
001aab169
0.60
0.5
0.3
Single high-speed switching diode
Section
0.80
0.65
0.25
0.10
[1]
04-09-13
14.
Packing quantity
3000
-115
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2007. All rights reserved.
BAS21J
10000
-135
7 of 10

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