CRS08(TE85R,Q,M) Toshiba, CRS08(TE85R,Q,M) Datasheet
CRS08(TE85R,Q,M)
Specifications of CRS08(TE85R,Q,M)
Related parts for CRS08(TE85R,Q,M)
CRS08(TE85R,Q,M) Summary of contents
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... Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc) ...
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Marking Abbreviation Code Part No. S8 CRS08 Standard Soldering Pad 1.2 1.2 2.8 Handling Precaution Schottky barrier diodes have reverse current characteristic compared to the other diodes. There is a possibility SBD may cause thermal runaway when it is used ...
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125°C 1 75°C 0.3 25°C 0.1 0.03 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 Instantaneous forward voltage v F Tℓ max – (AV) 140 120 DC 100 ...
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I – 1000 Pulse test 100 0.1 0. 100 Junction temperature T j (°C) (typ.) 4.8 Rectangular waveform 4.0 ...
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... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ...