PMGD780SN,115 NXP Semiconductors, PMGD780SN,115 Datasheet

MOSFET N-CH TRENCH DL 60V SOT363

PMGD780SN,115

Manufacturer Part Number
PMGD780SN,115
Description
MOSFET N-CH TRENCH DL 60V SOT363
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet

Specifications of PMGD780SN,115

Package / Case
SC-70-6, SC-88, SOT-363
Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
920 mOhm @ 300mA, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
490mA
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
1.05nC @ 10V
Input Capacitance (ciss) @ Vds
23pF @ 30V
Power - Max
410mW
Mounting Type
Surface Mount
Minimum Operating Temperature
- 55 C
Configuration
Dual
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.92 Ohm @ 10 V
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.49 A
Power Dissipation
410 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2369-2
934057709115
PMGD780SN T/R

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Quantity
Price
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Part Number:
PMGD780SN,115
Quantity:
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1. Product profile
2. Pinning information
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Dual N-channel enhancement mode field-effect transistor in a small SOT363 (SC-88)
Surface-Mounted Device (SMD) plastic package using TrenchMOS technology.
Table 1.
Pin
1
2
3
4
5
6
PMGD780SN
Dual N-channel μTrenchMOS standard level FET
Rev. 02 — 19 April 2010
Surface-mounted package
Standard level threshold voltage
Low on-state resistance
Driver circuits
V
P
DS
tot
≤ 0.41 W
≤ 60 V
Description
source1 (S1)
gate1 (G1)
drain2 (D2)
source2 (S2)
gate2 (G2)
drain1 (D1)
Pinning - SOT363 (SC-88), simplified outline and symbol
Simplified outline
SOT363 (SC-88)
Footprint 40 % smaller than SOT23
Fast switching
Dual device
Switching in portable appliances
I
R
D
DSon
≤ 0.49 A
1
6
≤ 920 mΩ
5
2
4
3
Graphic symbol
Product data sheet
D
S
1
1
G
1
D
S
2
2
msd901
G
2

Related parts for PMGD780SN,115

PMGD780SN,115 Summary of contents

Page 1

PMGD780SN Dual N-channel μTrenchMOS standard level FET Rev. 02 — 19 April 2010 1. Product profile 1.1 General description Dual N-channel enhancement mode field-effect transistor in a small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using TrenchMOS technology. 1.2 Features ...

Page 2

... NXP Semiconductors 3. Ordering information Table 2. Ordering information Type number Package Name PMGD780SN SC-88 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V drain-source voltage DS V drain-gate voltage DGR V gate-source voltage GS I drain current D I peak drain current ...

Page 3

... NXP Semiconductors 120 P der (%) 100 P tot × ---------------------- - 100% der P ° tot 25 C Fig 1. Normalized total power dissipation as a function of solder point temperature ( ° single pulse Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PMGD780SN_2 Product data sheet ...

Page 4

... NXP Semiconductors 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter R thermal resistance from junction to solder point th(j-sp th(j-sp) (K/W) δ 0.2 0.1 0.05 0.02 10 single pulse Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration PMGD780SN_2 Product data sheet Dual N-channel μ ...

Page 5

... NXP Semiconductors 6. Characteristics Table 5. Characteristics ° unless otherwise specified. j Symbol Parameter Static characteristics V drain-source breakdown voltage (BR)DSS gate-source threshold voltage V GS(th) I drain leakage current DSS I gate leakage current GSS R drain-source on-state resistance DSon Dynamic characteristics Q total gate charge G(tot) Q gate-source charge ...

Page 6

... NXP Semiconductors (A) 1 ° Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values 3 V ( DSon (Ω 0.2 0 ° Fig 7. Drain-source on-state resistance as a function of drain current; typical values PMGD780SN_2 Product data sheet 03an88 4.5 4 3 (V) DS Fig 6. ...

Page 7

... NXP Semiconductors 2.4 V GS(th) (V) typ 1.8 1.2 min 0.6 0 − 0.25 mA Fig 9. Gate-source threshold voltage as a function of junction temperature MHz GS Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values PMGD780SN_2 Product data sheet Dual N-channel μTrenchMOS standard level FET ...

Page 8

... NXP Semiconductors (A) 0.8 0.6 0.4 150 °C 0 0.3 0 °C and 150 ° Fig 12. Source current as a function of source-drain voltage; typical values PMGD780SN_2 Product data sheet Dual N-channel μTrenchMOS standard level FET 03an91 ° 0.9 1 Fig 13. Gate-source voltage as a function of gate All information provided in this document is subject to legal disclaimers. Rev. 02 — ...

Page 9

... NXP Semiconductors 7. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 Fig 14. Package outline SOT363 (SC-88) PMGD780SN_2 Product data sheet scale 2.2 1.35 2 ...

Page 10

... NXP Semiconductors 8. Soldering Fig 15. Reflow soldering footprint SOT363 (SC-88) PMGD780SN_2 Product data sheet Dual N-channel μTrenchMOS standard level FET 2.65 2.35 1.5 0.6 0.5 (4×) (4×) 0.5 (4×) 0.6 (4×) 1.8 All information provided in this document is subject to legal disclaimers. Rev. 02 — 19 April 2010 PMGD780SN 0.4 (2× ...

Page 11

... Document ID Release date PMGD780SN_2 20100419 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 5 • Section 10 “Legal PMGD780SN_1 ...

Page 12

... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...

Page 13

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 14

... NXP Semiconductors 12. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 10 Legal information ...

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