UDA1342TSDB NXP Semiconductors, UDA1342TSDB Datasheet - Page 41

• Manufacturer Part Number: UDA1342TSDB
• Description: Audio CODECs AUDIO CODEC MINIDISC
• Manufacturer: NXP Semiconductors

Specifications of UDA1342TSDB

• Number Of Adc Inputs: 4
• Number Of Dac Outputs: 2
• Conversion Rate: 110 KSPs
• Interface Type: Serial (I2C), L3
• Resolution: 24 bit
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SSOP-28
• Minimum Operating Temperature: - 40 C
• Number Of Channels: 6
• Snr: 100 dB
• Supply Current: 20 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: UDA1342TS/N1,512

NXP Semiconductors
19 SOLDERING
19.1
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
19.2
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
19.3
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
2000 Jul 31
Audio CODEC
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
41
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
• For packages with leads on two sides and a pitch (e):
• For packages with leads on four sides, the footprint must
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
19.4
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
turbulent wave with high upward pressure followed by a
smooth laminar wave.
– larger than or equal to 1.27 mm, the footprint
– smaller than 1.27 mm, the footprint longitudinal axis
The footprint must incorporate solder thieves at the
downstream end.
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
must be parallel to the transport direction of the
printed-circuit board.
Manual soldering
UDA1342TS
Product specification