TDA8566Q/N2C NXP Semiconductors, TDA8566Q/N2C Datasheet - Page 17

• Manufacturer Part Number: TDA8566Q/N2C
• Description: Audio Amplifiers 2X25W BTL STEREO RADIO PWR AMP
• Manufacturer: NXP Semiconductors

Specifications of TDA8566Q/N2C

• Product: Class-B
• Output Power: 55 W
• Available Set Gain: 26 dB
• Common Mode Rejection Ratio (min): 60 dB
• Thd Plus Noise: 0.05 %
• Operating Supply Voltage: 14.4 V
• Maximum Power Dissipation: 60000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 6 V
• Output Type: 2-Channel Stereo
• Package / Case: DBS17P
• Operational Class: Class-B
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Output Power (typ): 55x2@2OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.05@4Ohm@1W%
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 60W
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 6V
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 17
• Package Type: DBS17P
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TDA8566Q/N2C,112

NXP Semiconductors
TDA8566_6
Product data sheet
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 9.
Table 10.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
10
13.
Rev. 06 — 15 October 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
2
3
3
40 W/2
)
)
Figure
350 to 2000
260
250
245
stereo BTL car radio power amplifier
13) than a PbSn process, thus
220
220
350
> 2000
260
245
245
TDA8566
© NXP B.V. 2007. All rights reserved.
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