TDA8931T NXP Semiconductors, TDA8931T Datasheet - Page 28

Comparator ICs 1 CHAN CLASS D AMP 1X15W

TDA8931T

Manufacturer Part Number
TDA8931T
Description
Comparator ICs 1 CHAN CLASS D AMP 1X15W
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA8931T

Number Of Channels
1 Channel
Product
Digital Comparators
Response Time
0.12 us
Offset Voltage (max)
10 mV
Input Bias Current (max)
0.06 uA
Supply Voltage (max)
35 V
Supply Voltage (min)
12 V
Maximum Power Dissipation
2500 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
SOT-163
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TDA8931T/N1,112

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA8931T
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
TDA8931TN1
Quantity:
2 000
Philips Semiconductors
9397 750 13847
Preliminary data sheet
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[5]
[6]
[7]
[8]
[9]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 01 — 14 January 2004
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Power comparator 1
TDA8931
28 of 31
20 W

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